Motorola Cdm Series Basic 6881091c62 D Manual

							Introduction1-3
Fax Orders
Customer Care and Services Division*
1-800-622-6210
847-576-3023 (International)
USFGMD
(Federal Government Orders)
1-800-526-8641 (For Parts and Equipment Purchase Orders)
Parts Identification
Customer Care and Services Division*
(United States and Canada)
1-800-422-4210, menu 3
Product Customer Service
Customer Response Center*
(Non-technical Issues)
1-800-247-2346
FAX:1-800-247-2347
*The Customer Care and Services Division (CCSD) was formerly known as the Accessories and 
Aftermarket Division (AAD).
1.2.4 Technical Support
Technical support is available to assist the dealer/distributor in resolving any malfunction which may 
be encountered. For service, contact the Service Depot in your area. If your area does not have a 
depot, please contact your Business Development Manager, Distributor, or contact Motorola 
Technical Support. When contacting Motorola Technical Support, keep the product model number 
and the unit’s serial number handy.
For service, contact one of the following Depots. Please call and confirm your return before sending 
the unit to the depot for service.
Motorola Radio Support Center
2200 Galvin Dr.
Elgin, IL 60123
1-800-227-6772
Motorola Toronto Service Center
3900 Victoria Avenue
North York, Ontario, Canada M2H 3H7
1-800-543-3222 
1-416-756-5841
1-888-331-9872 (Fax)
Motorola U.S. Federal Government Depot
4395 Nicole Drive
Lanham, MD 20706
1-800-969-6680
1-301-731-6676 
						

							1-4Introduction
1.3 Radio Model Information
The model number and serial number are located on a label attached to the back of your radio. You 
can determine the RF output power, frequency band, protocols, and physical packages. The example 
below shows one mobile radio model number and its specific characteristics.
Example: AAM25RHC9AA1AN
Table 1-1:  Radio Model Number 
Ty p e  
of 
UnitModel 
SeriesFreq. 
BandPower 
LevelPhysical 
PackagesChannel 
SpacingProtocolFeature 
LevelModel
RevisionModel 
Package
AA M25K
VHF
(136-
174MHz)H
1-
25WA
No 
Display, 
No Keypad9AA1
4 Chan.AN
R
UHF1
(403-
470MHz)K
25-
40WC
No Display
Basic Key-
padDU
LT R2
64 Chan.
S
UHF2
(450-
512MHz)D
1-Line 
Display, 
Limited 
KeypadDP
PassPort5
128 
Chan.
B
Low 
Band, R1 
(29.7-
36.0MHz)F
1-Line 
Display, 
Standard 
Keypad6
160 
Chan.
LT R /
Passport
w/MDC 
on Conv.
C
Low 
Band, R2 
(36.0-
42.0MHz)8
160 
Chan.
D
Low 
Band, R3 
(42.0-
50.0MHz)
AA = Motorola Internal Use
M = Mobile
Programmable
Conventional 
						

							2-1
Chapter 2
Maintenance
2.1 Introduction
This chapter provides details about the following:
lPreventive maintenance (inspection and cleaning) 
lSafe handling of CMOS and LDMOS devices
lDisassembly and reassembly of the radio
lInstallation of optional retrofit kit
lInstallation of option boards
2.2 Preventive Maintenance
The radios do not require a scheduled preventive maintenance program; however, periodic visual 
inspection and cleaning is recommended.
2.2.1 Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches are 
functional. It is not recommended to inspect the interior electronic circuitry.
2.2.2 Cleaning Procedures
The following procedures describe the recommended cleaning agents and the methods to be used 
when cleaning the external and internal surfaces of the radio. External surfaces include the front 
cover, housing assembly, and battery case. These surfaces should be cleaned whenever a periodic 
visual inspection reveals the presence of smudges, grease, and/or grime.
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild 
dishwashing detergent in water. The only factory recommended liquid for cleaning the printed circuit 
boards and their components is Isopropyl alcohol (100% by volume).
Cleaning External Plastic Surface
Apply the 0.5% detergent-water solution sparingly with a stiff, non-metallic, short-bristled brush to 
work all loose dirt away from the radio. Use a soft, absorbent, lintless cloth or tissue to remove the 
solution and dry the radio. Make sure that no water remains entrapped near the connectors, cracks, 
or crevices.
Cleaning Internal Circuit Boards and Components
Isopropyl alcohol (100%) may be applied with a stiff, non-metallic, short-bristled brush to dislodge 
embedded or caked materials located in hard-to-reach areas. The brush stroke should direct the Note:
Internal surfaces should be cleaned only when the radio is disassembled for service 
or repair.
CAUTION: Certain chemicals and their vapors can have harmful effects on certain 
plastics. Avoid using aerosol sprays, tuner cleaners, and other chemicals.!
C a u t i o n 
						

							2-2Maintenance
dislodged material out and away from the inside of the radio. Make sure that controls or tunable 
components are not soaked with alcohol. Do not use high-pressure air to hasten the drying process 
since this could cause the liquid to collect in unwanted places. After completing the cleaning process, 
use a soft, absorbent, lintless cloth to dry the area. Do not brush or apply any Isopropyl alcohol to the 
frame, front cover, or back cover.
2.3 Safe Handling of CMOS and LDMOS Devices
 
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios, and are 
susceptible to damage by electrostatic or high voltage charges. Damage can be latent, resulting in 
failures occurring weeks or months later. Therefore, special precautions must be taken to prevent 
device damage during disassembly, troubleshooting, and repair. 
Handling precautions are mandatory for CMOS circuits and are especially important in low humidity 
conditions. DO NOT attempt to disassemble the radio without first referring to the above CAUTION 
statement.
2.4 Repair Procedures and Techniques — General
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement part is 
not locally available, check the parts list for the proper Motorola part number. Order parts from the 
nearest Motorola Communications parts center listed in Chapter 1, Introduction. Note:
Always use a fresh supply of alcohol and a clean container to prevent contamination 
by dissolved material (from previous usage).
CAUTION: This radio contains static-sensitive devices. Do not open the radio unless 
you are properly grounded. Take the following precautions when working 
on this unit:
lStore and transport all CMOS devices in conductive material so that all exposed 
leads are shorted together. Do not insert CMOS devices into conventional plastic 
“snow” trays used for storage and transportation of other semiconductor devices.
lGround the working surface of the service bench to protect the CMOS device. We 
recommend using the Motorola Static Protection Assembly (part number 
0180386A82), which includes a wrist strap, two ground cords, a table mat, and a 
floor mat.
lWear a conductive wrist strap in series with a 100k resistor to ground. (Replace-
ment wrist straps that connect to the bench top covering are Motorola part number 
RSX-4015.)
lDo not wear nylon clothing while handling CMOS devices.
lDo not insert or remove CMOS devices with power applied. Check all power sup-
plies used for testing CMOS devices to be certain that there are no voltage tran-
sients present.
lWhen straightening CMOS pins, provide ground straps for the apparatus used.
lWhen soldering, use a grounded soldering iron.
lIf at all possible, handle CMOS devices by the package and not by the leads. Prior 
to touching the unit, touch an electrical ground to remove any static charge that 
you may have accumulated. The package and substrate may be electrically com-
mon. If so, the reaction of a discharge to the case would cause the same damage 
as touching the leads.
!
C a u t i o n 
						

							Maintenance2-3
Rigid Circuit Boards
This family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not 
accessible, some special considerations are required when soldering and unsoldering components. 
The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise 
care to avoid pulling the plated circuit out of the hole.
When soldering near the 20-pin and 40-pin connectors: 
lAvoid accidentally getting solder in the connector. 
lBe careful not to form solder bridges between the connector pins. 
lExamine your work closely for shorts due to solder bridges.
2.5 Disassembling and Reassembling the Radio — General
Since these radios may be disassembled and reassembled with the use of only six (board to casting) 
screws (nine for LowBand), it is important to pay particular attention to the snaps and tabs, and how 
parts align with each other.
The following tools are required for disassembling the radio:
lSmall flat blade screwdriver
lTORX™ T20 screwdriver
lDismantling Tool
If a unit requires more complete testing or service than is customarily performed at the basic level, 
send the unit to a Motorola Authorized Service Center. (See Chapter 1, Introduction for a list of 
regional service centers.)
The following disassembly procedures should be performed only if necessary. 
2.6 Radio Disassembly — Detailed
The procedure to remove and replace a control head is similar for all models of radio. A typical 
procedure is therefore shown followed by specific disassembly procedures for the different control 
heads.
2.6.1 Control Head Removal
1. Insert the dismantling tool in the groove between the control head and the radio assembly as 
shown in Figure 2-1,  on page 2-19.
2. Press on the dismantling tool until the snap connectors on the side of the control head release 
from the radio assembly. 
						

							2-4Maintenance
Figure 2-1:  Typical Control Head Removal
3. Pull the control head away from the radio assembly as shown in Figure 2-2.
Figure 2-2: Flexible Connection Removal
4. Remove the flexible connection from the socket on the control head board.
2.6.2 Top Cover Removal
1. Insert the dismantling tool in the middle of the radio assembly side groove as shown in Figure 2-3.
2. Press on the dismantling tool until the snap connectors on the side of the cover release from the 
radio chassis.
Dismantling 
To o l
Flexible
Connection 
						

							Maintenance2-5
3. Lift the top cover from the chassis.
Figure 2-3: Top Cover Removal
2.6.3 Transceiver Board Removal
1. Remove six screws (nine for LowBand) from the diecast cover using the T20 TORX™ driver as 
shown in Figure 2-4.
2. Lift the cover from the chassis.
Figure 2-4: Diecast Cover Removal
Dismantling 
Tool
Diecast
Cover
Screws (6 or 9)
Radio 
Chassis 
						

							2-6Maintenance
3. Slowly lift the transceiver board on the edge at the front of the radio (the edge that mates with the 
control head) and pull gently toward the front of the radio as shown in Figure 2-5. Take care to 
slide the antenna connector and power connector out of the chassis towards the front.
Figure 2-5: Transceiver Board Removal
2.6.3.1 LowBand Transceiver Board Removal
1. Remove the Control Head and Top Cover as directed in Sections 2.6.1 and 2.6.2 of this Manual.
2. Using the T20 TORX™ driver, remove the nine screws holding the die cast cover to the radio 
chassis.
3. Remove the 20-pin accessory connector from the rear of the radio by pulling on it away from the 
radio chassis with one hand while holding the radio chassis with the other.
4. Remove the plastic protective cover over the opening at the front of the radio chassis that allows 
access to the 18-pin flex connector.
5. With the chassis sitting on the tabletop, insert one side of the dismantling tool, 6686119B01, into 
the bottom of the opening at the front of the radio chassis. With the tool inserted between the bot-
tom of the 18-pin flex connector and the radio chassis, use it to gently pry the transceiver board 
up from the radio chassis. The transceiver board may stick to the radio chassis as a result of the 
thermal material that is used between the heat dissipating devices and the radio chassis. Con-
tinue applying an up and down force to the transceiver board until the various components 
become unstuck, and the transceiver board becomes loose enough to remove from the radio 
chassis.
6. Once the transceiver board is removed from the radio chassis, handle it per the procedure for 
“Safe Handling of CMOS and LDMOS Devices”, Section 2.3. In addition, take care not to disturb 
the thermal pad material that may adhere to the devices that mate with the thermal pads located 
on the radio chassis. Do not disturb the thermal pad on the radio chassis as well. Also, do not dis-
rupt the conductive bead gasket that is applied to the radio chassis walls.
2.6.3.2. Removing and Replacing Defective LDMOS Devices (Q1402 and Q1403)
1. Note that if one of the two Final stage devices (Q1402 or Q1403) is defective (i.e., TP1402 or 
TP1403 resistance to ground is less than 25 kOhms), replace both devices, since the other  Note:
If removing the transceiver board from the radio chassis causes the traces of the 
board to lift up away from the board, most noticeably around the final devices 
(Q1402, Q1403), the transceiver board must be scrapped and a new replacement 
transceiver board is required.
Lift
Antenna
Connector 
						

							Maintenance2-7
device may have been over-stressed as well. Handle the transceiver board per the procedure for 
“Safe Handling of CMOS and LDMOS Devices”, Section 2.3.
2. If removing the transceiver board, the thermal pad material under the two Final stage devices 
(Q1402 and Q1403) on the radio chassis has been pulled up such that the radio chassis is 
exposed through the thermal pad, then the defective thermal pads must be removed and 
replaced. This is only true for the case when the Final stage devices are being replaced. To 
remove the thermal pads, use a plastic scraper to prevent scratching of the radio chassis. Use a 
0.5% detergent-water solution to remove any residue left on the radio chassis.
3. Remove the defective Final stage LDMOS devices from the transceiver board with a heat gun. 
Care should be taken not to cause displacement of any other parts.
4. Clean any excess solder from the device pads so that new devices can sit flush with the board.
5. Hand solder on a replacement LDMOS device, with a suitable size soldering iron, by applying sol-
der to one lead and pad. Press the replacement LDMOS device with a dismantling tool from the 
top and reheat the lead and pad to cause the solder to reflow. Applying slight pressure on the 
device with the dismantling tool will avoid gaps between the lead and the board. Continue this 
approach and solder the remaining leads on one side of the LDMOS device. Once one side of the 
device leads are soldered continue with the other side while pressing the LDMOS device to the 
board with the dismantling tool. Finish soldering all leads taking care not to cause any shorts to 
nearby components or shorts across the device leads.
6. This step is necessary only if Step (2) from above was required, that is, if the thermal pad was 
required to be scraped off the radio chassis. If so, replace the thermal pad(s) from a 0.9 inch wide 
roll of Bergquist “Softface” replacement material, 3280384M34. Cut the material to a 0.25 inch 
length. 
Remove the clear plastic backing from the replacement pad and stick the side from which the 
backing was removed to the bottom side of the Final device(s) requiring a new pad. Press the 
pad firmly to the bottom of the device making sure that it properly adheres to the device.
7. Reassemble the radio per Section 2.7.3.1, LowBand Radio Chassis and Transceiver Board 
Assembly.
8. Using the radio’s Customer Programming Software (CPS), reset the Bias Voltage for each of the 
Final devices and retune the radio’s power output.
2.6.4 CDM750 Control Head Disassembly
1. To dismount the control head housing from the back housing, insert the dismantling tool in the 
groove between the two housings as shown in Figure 2-6. Note:
DO NOT use a heat gun to solder a replacement LDMOS device to the board. This 
may cause damage to the LDMOS device.
Note:
Exceeding the 0.25 inch length may result in an electrical short of any component 
that comes in contact with the thermal pad. 
						

							2-8Maintenance
Figure 2-6: Control Head Back Housing Removal
2. Press the dismantling tool until the snap connectors on the side of the back housing release from 
the control head.
3. Disconnect the speaker socket.
Figure 2-7: Control Head Board Knob Removal
4. Remove the board from the control head housing by stretching the control head housing and pull-
ing up on the board as shown in Figure 2-7 and Figure 2-8.
5. Remove the keypad from the control head housing by lifting up the rubber keypad.
Note:
DO NOT touch or contaminate the conductive pads on the under side of the keypad 
or the conductive contacts on the printed circuit board.