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Motorola Gm Series Detailed 6864115b62 A Manual

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    							iii
    Table of Contents
    Chapter 1 MODEL CHART AND TECHNICAL SPECIFICATIONS
    1.0 GM360 Model Chart............................................................................................. 1-1
    2.0 Technical Specifications ...................................................................................... 1-1
    Chapter 2 THEORY OF OPERATION
    1.0 Introduction .......................................................................................................... 2-1
    2.0 Low Band  Receiver ............................................................................................. 2-2
    2.1 Receiver Front-End ........................................................................................ 2-2
    2.2 Front-End Band-Pass Filters & Pre-Amplifier ................................................. 2-3
    2.3 First Mixer  ...................................................................................................... 2-3
    2.4 High Intermediate Frequency (IF) and Receiver Back End ............................ 2-3
    2.5 Low Intermediate Frequency (IF) and Receiver Back End ............................. 2-4
    2.6 Extender (Noise Blanker) ............................................................................. 2-4
    3.0 Low Band  Transmitter Power Amplifier (PA) 25-60 W ......................................... 2-5
    3.1 Power Controlled Stage .................................................................................. 2-5
    3.2 Driver Stage.................................................................................................... 2-5
    3.3 Final Stage ..................................................................................................... 2-6
    3.4 Antenna Switch............................................................................................... 2-6
    3.5 Harmonic Filter ............................................................................................... 2-6
    3.6 Power Control ................................................................................................. 2-6
    3.7 TX Safety Switch ............................................................................................ 2-6
    4.0 Low Band  Frequency Synthesis.......................................................................... 2-7
    4.1 Fractional-N Synthesizer ................................................................................ 2-7
    4.2 Voltage Controlled Oscillator (VCO) ............................................................... 2-9
    4.3 Synthesizer Operation .................................................................................. 2-10
    Chapter 3 TROUBLESHOOTING CHARTS
    1.0 Troubleshooting Flow Chart for Transmitter  ....................................................... 3-1
    2.0 Troubleshooting Flow Chart for Receiver (Sheet 1 of 2)...................................... 3-2
    2.1 Troubleshooting Flow Chart for Receiver (Sheet 2 of 2)...................................... 3-3
    3.0 Troubleshooting Flow Chart for Synthesizer ........................................................ 3-4
    4.0 Troubleshooting Flow Chart for VCO   ................................................................. 3-5 
    						
    							iv
    Chapter 4 Low Band PCB/SCHEMATICS/PARTS LISTS
    1.0 Allocation of Schematics and Circuit Boards ....................................................... 4-1
    1.1 Controller Circuits ................................................................................................ 4-1
    2.0 LB1 25-60W PCB 8486206B06 / Schematics ..................................................... 4-3
    2.1 LB1 25-60W PCB 8486206B06 Parts List ......................................................... 4-13
    3.0 LB2 25-60W PCB 8486207B05 / Schematics ................................................... 4-17
    3.1 LB2 25-60W PCB 8486207B05 Parts List ......................................................... 4-27
    4.0 LB3 25-60W PCB 8485908z03 / Schematics .................................................... 4-31
    4.1 LB3 25-60W PCB 8485908z03 Parts List.......................................................... 4-41 
    						
    							Chapter 1
    MODEL CHART AND TECHNICAL SPECIFICATIONS
    1.0 GM360 Model Chart
    2.0 Technical Specifications
    Data is specified for +25°C unless otherwise stated.
    GM Series Low Band 29-50 MHz
    Model Description
    MDM25BKF9AN5_EGM360 LB1, 29.0-36.0 MHz, 25-60W, 255 Ch
    MDM25CKF9AN5_E GM360 LB2, 36.0-42.0 MHz, 25-60W, 255 Ch
    MDM25DKF9AN5_EGM360 LB3, 42.0-50.0 MHz, 25-60W, 255 Ch
    Item Description
    XXXGCN6114_ Control Head, GM360
    XIMUB6003_SField Replaceable Unit (Main Board) GM360
    X IMUB6004_S Field Replaceable Unit (Main Board) GM360
    XIMUB6005_SField Replaceable Unit (Main Board) GM360
    XXXENBN4056_ Packaging, Waris Mobile
    XXXHKN9402_12V Power Cable
    XXXMDRMN4025_ Enhanced Compact Microphone
    XXXRLN4774_3 Point Mount
    XXX6864110B81_ User Guide, GM360
    X = Indicates one of each is required
    General Specifications
    Channel Capacity
    GM360
    255
    Power Supply 13.2Vdc (10.8 - 15.6Vdc)
    Dimensions:  H x W x D (mm)  Height excluding knobsGM360
    59mm x 179mm x 250mm
    (add 9mm for Volume Knob)
    Weight 2064gr
    Sealing:Withstands rain testing per 
    MIL STD 810 C/D /E and IP54
    Shock and Vibration:Protection provided via impact
    resistant housing exceeding MIL STD 
    810-C/D /E and TIA/EIA 603
    Dust and Humidity:Protection provided via environment 
    resistant housing exceeding MIL STD 
    810 C/D /E and TIA/EIA 603 
    						
    							1-2 MODEL CHART AND TECHNICAL SPECIFICATIONS
    *Availability subject to the laws and regulations of individual countries.
    Transmitter LB1 LB2 LB3
    *Frequencies - Full BandsplitLB1 29.7-36.0 MHzLB2 36.0-42.0 MHzLB2 42.0-50.0 MHz
    Channel Spacing12.5/20/25 kHz12.5/20/25 kHz12.5/20/25 kHz
    Frequency Stability
    (-30°C to +60°C, +25° Ref.)±5.0 ppm±5.0 ppm±5.0 ppm
    Power 25-60W 25-60W 25-60W
    Modulation Limiting±2.5 @ 12.5 kHz 
    ±4.0 @ 20 kHz
    ±5.0 @ 25 kHz±2.5 @ 12.5 kHz 
    ±4.0 @ 20 kHz
    ±5.0 @ 25 kHz±2.5 @ 12.5 kHz 
    ±4.0 @ 20 kHz
    ±5.0 @ 25 kHz
    FM Hum & Noise-40 dB @ 12.5kHz
    -45 dB @ 20/25kHz-40 dB @ 12.5kHz
    -45 dB @ 20/25kHz-40 dB @ 12.5kHz
    -45 dB @ 20/25kHz
    Conducted/Radiated Emission (ETS)-26 dBm-26 dBm-26 dBm
    Adjacent Channel Power-60 dB @ 12.5 kHz
    -70 dB @ 25 kHz-60 dB @ 12.5 kHz
    -70 dB @ 25 kHz-60 dB @ 12.5 kHz
    -70 dB @ 25 kHz
    Audio Response (300 - 3000 Hz)+1 to -3 dB+1 to -3 dB+1 to -3 dB
    Audio Distortion
    @1000Hz, 60%
    Rated Maximum Deviation65 dB
    Adjacent Channel Selectivity (ETS)
    65 dB @ 12.5 kHz 
    75 dB @ 20 kHz
    80 dB @ 25 kHz65 dB @ 12.5 kHz 
    75 dB @ 20 kHz
    80 dB @ 25 kHz65 dB @ 12.5 kHz 
    75 dB @ 20 kHz
    80 dB @ 25 kHz
    Spurious Rejection (ETS)75 dB @ 12.5 kHz
    80 dB @ 20/25 kHz75 dB @ 12.5 kHz
    80 dB @ 20/25 kHz75 dB @ 12.5 kHz
    80 dB @ 20/25 kHz
    Rated Audio3W Internal
    13W External3W Internal
    13W External3W Internal
    13W External
    Audio Distortion @ Rated Audio
    						
    							Chapter 2
    THEORY OF OPERATION
    1.0 Introduction
    This Chapter provides a detailed theory of operation for the LowBand circuits in the radio. For details 
    of the theory of operation and trouble shooting for the the associated Controller circuits refer to the 
    Controller Section of this manual. 
    						
    							2-2THEORY OF OPERATION
    2.0 Low Band Receiver
    2.1 Receiver Front-End
    The low band receiver is bandsplit into three ranges depending on radio model, covering frequencies 
    from 29.7 to 36.0 MHz, 36.0 to 42.0 MHz, or 42.0 to 50.0 MHz. The circuitry of the three models is 
    identical except for component value differences. The receiver consists of five major blocks: front-end 
    bandpass filters and pre-amplifier, first mixer, high-IF and blanker switches, low-IF and receiver back-
    end, and “Extender” (noise blanker). Two fixed-tuned bandpass filters perform antenna signal pre-
    selection. A cross over quad diode mixer converts the signal to the high - IF of 10.7 MHz. High-side 
    first injection is used.
    Figure 2-1 Low Band Receiver Block Diagram
    Demodulator
    Delay 
    Filter
    Mixer Fixed 
    Tuned Filter RF Amp
    Tuned Filter Pin Diode 
    Antenna 
    Switch
    RF Jack Antenna
    First LO
    RXINJ
    Recovered Audio
    RSSI
    IF
    Second LO
    Crystal 
    Filter
    455kHz Filter455kHz Filter
    455kHz Filter
    (12.5kHz)455kHz Filter
    (12.5kHz)SwitchSwitchSwitchSwitch
    Limiter
    IF Amp
     IF Amp
    Filter Bank Selection
    from  Synthesizer IC
    BlankerNoise
    Blanking Pulses
    GateBuffer
    Enable
    1st
    Fixed 
    (25/20kHz)
    BWSELECT
    (U1201 Pin 48)4-pole(25/20kHz) 
    						
    							Low Band Receiver2-3
    There are two 2-pole 10.7 MHz crystal filters in the high-IF section and two switched pairs of 
    455 kHz ceramic filters in the low-IF section to provide the required adjacent channel selectivity. 
    The second IF at 455 kHz is mixed, amplified and demodulated in the IF IC. The processing of the 
    demodulated audio signal is performed by an audio processing IC located in the controller section.
    2.2 Front-End Band-Pass Filters & Pre-Amplifier 
    The received signal from the radio’s antenna connector is first routed through the harmonic filter and 
    antenna switch, which are part of the RF power amplifier circuitry, before being applied to the 
    receiver 5-pole antenna filter (L1001-L1005 and associated components). This filter configuration 
    provides more rapid attenuation above the passband to provide better rejection of the half-IF 
    spurious response. A dual hot carrier diode (D1001) limits any inband signal to 0 dBm to prevent 
    damage to the RF pre-amplifier
    The RF pre-amplifier is an SMD device (Q1001) with collector-base feedback to stabilize gain, 
    impedance, and intermodulation. Transistor Q1002 compares the voltage drop across resistor 
    R1005 with a fixed base voltage from divider R1006 and R1007, and adjusts the base current of 
    Q1001 as necessary to maintain its collector current constant at 25 mA. Operating voltage is from 
    the regulated 9.3V supply (9V3). During transmit, 9.1 volts (9T1) turns on both transistors in U1001, 
    turning off Q1003 and therefore Q1001-2. This protects the RF pre-amplifier from excessive 
    dissipation during transmit mode.
    A second 5-pole fixed-tuned bandpass filter provides additional filtering of the amplified signal. This 
    filter configuration also provides steeper attenuation above its passband for best half-IF attenuation.
    2.3 First Mixer
    The signal coming from the front-end is converted to the high-IF frequency of 10.7 MHz using a 
    cross over quad diode mixer (U1051). The high-side injection signal (RXINJ) from the frequency 
    synthesizer circuitry is filtered by a 7-pole low-pass filter (L1012-14 and associated circuitry) which 
    removes second harmonic content from the injection signal and improves half-IF rejection. The 50-
    ohm output of the first mixer is applied to the input of the high-IF circuit block.
    2.4 High Intermediate Frequency (IF) and Blanker Switches
    The first mixer IF output signal (IF) is applied to a diplexer network consisting of L1101, L1111 and 
    associated components. This network has three functions: it terminates the mixer output at 
    frequencies other than 10.7 MHz into 51-ohm resistor R1101; it matches the 50-ohm mixer output to 
    the first IF amplifier (Q1101) input; and it provides bandpass filtering at 10.7 MHz to prevent the 5.35 
    MHz half-IF component of the mixer output from creating a second harmonic at 10.7 MHz in Q1101, 
    which degrades half-IF rejection.
    The IF amplifier Q1101 uses ac and dc feedback to stabilize gain and quiescent current 
    (approximately 28 mA). Operating voltage is from the regulated 9.3V supply (9V3). Its output is 
    applied to a 10.7 MHz ceramic filter FL1101 which has a 3 dB bandwidth of 270 kHz and provides a 
    time delay of 2.6 usec. This delay allows enough time for the “Extender” to respond to impulse noise 
    present at the input of Q1101 and operate the blanker switches Q1102 and Q1103, muting the IF 
    signal for the duration of the noise pulse. L1104 and L1105 also provide additional selectivity and 
    time delay. Operation of the “Extender” circuit is explained in Section 8.5 below.
    When the blanker switches turn “on” to mute the IF signal, they momentarily change the impedance 
    of resonant circuits L1104 and L1105 from high to very low. This abrupt impedance change, if  
    						
    							2-4THEORY OF OPERATION
    presented to the high-Q crystal filters FL1102 and FL1103, would cause ringing of the filter 
    response, stretching an otherwise narrow impulse into a long and audible output waveform. 
    Therefore, source follower stage Q1104 isolates the blanker switches from the crystal filters, 
    providing a consistent source impedance via matching network L1106, L1107 and associated 
    components. Q1104 has unity voltage gain in this configuration.
    Crystal filters FL1102 and FL1103 are 2-pole, 10.7 MHz units configured to provide an overall 4-
    pole response having a 3 dB bandwidth of approximately 12 kHz. The output is amplified by second 
    IF amplifier Q1106 and applied to the low-IF circuitry, pin 1 of IF IC (U1103). A dual hot carrier diode 
    (D1101) limits the amplifier output voltage swing to prevent overdriving the IF IC at RF input levels 
    above -27 dBm.
    2.5 Low Intermediate Frequency (IF) and Receiver Back End
    The 10.7 MHz high-IF signal from the second IF amplifier feeds the IF IC (U1103) at pin1. Within the 
    IF IC, the 10.7 MHz high -IF signal mixes with the 10.245 MHz second local oscillator (2nd LO) to 
    produce the low-IF signal at 455 kHz. The 2nd LO frequency is determined by crystal Y1101. The 
    low -IF signal is amplified and filtered by external pairs of 455 kHz ceramic filters (FL1105 and 
    FL1107 for 20 kHz channel spacing, or FL1104 and FL1106 for 12.5 kHz channel spacing). 
    Selection of the appropriate filter pair is accomplished by U1101 and U1102, controlled by the 
    BWSELECT line from pin 48 of the synthesizer IC U1201. The filtered output from the ceramic filters 
    is applied to the limiter input pin of the IF IC (pin 14).
    The IF IC contains a quadrature detector using a ceramic phase-shift element (Y1102) to provide 
    audio detection. Internal amplification provides an audio output level of 120 mV rms (at 60% 
    deviation) from U1103 pin8 (AUDIOOUT) which is fed to the ASFIC_CMP (U0221) pin 2 (part of the 
    Controller circuitry).
    A received signal strength indicator (RSSI) signal is available at U1103 pin 5, having a dynamic 
    range of 70 dB. The RSSI signal is interpreted by the microprocessor (U0101 pin 63) and in addition 
    is available at accessory connector J0501-15.
    2.6 “Extender” (Noise Blanker)
    The 10.7 MHz output from the first mixer, which is present at the input of first IF amp Q1101, is also 
    routed to the input of the “Extender” (noise blanker) circuitry and amplified by FET Q1610. The high 
    input impedance of the FET stage minimizes loading of the signal in the receiver path. The output of 
    Q1610 is further amplified by U1601, which is a wide-bandwidth, high gain differential amplifier 
    (used in a single-ended configuration) incorporating an AGC gain control input. This gain block 
    provides linear amplification of the instantaneous amplitude of the 10.7 MHz signal at the first mixer 
    output. The output of U1601 is coupled to biased-detector Q1603. The bias is set so that noise 
    impulses of a sufficient amplitude cause Q1603 to conduct. The following stages (Q1604 through 
    Q1606) provide additional gain and pulse shaping which slows the turn-on and turn-off waveform 
    applied to IF blanker switches Q1102 and Q1103. The result is that, for each noise impulse, the IF 
    signal is smoothly ramped off and then on again, preventing the pulse from reaching the narrow IF 
    selectivity, where ringing would cause an objectionable spike at the detector of a much longer 
    duration than the original impulse.
    If the repetition rate of noise impulses is so rapid that the noise blanker can no longer blank them 
    individually, as indicated by a large increase in high-frequency content at the output of Q1604, stage 
    Q1607 amplifies this level and turns on level detector Q1609. Its output is highly filtered into a DC 
    voltage level which is proportional to the repetition rate of the noise impulses, and this is applied to 
    the AGC input pin 5 of U1601, reducing its gain and therefore the amount of noise pulses which are 
    detected and processed. 
    						
    							Low Band Transmitter Power Amplifier (PA) 25-60 W 2-5
    3.0 Low Band Transmitter Power Amplifier (PA) 25-60 W
    The radio’s 60 W PA is a three-stage amplifier used to amplify the output from the VCO to the radio 
    transmit level. The line-up consists of three stages which utilize LDMOS technology. The first stage 
    is pre-driver (U1401) that is controlled by pin 4 of PCIC (U1503) via Q1504 and Q1505 
    (CNTLVLTG). It is followed by driver stage Q1401, and final stage utilizing two devices (Q1402 and 
    Q1403) connected in parallel. Q1402 and Q1403 are in direct contact with the heat sink. 
    To prevent damage to the final stage devices, a safety switch has been installed to prevent the 
    transmitter from being keyed with the cover removed.
    Figure 2-2 LowBand Transmitter Block Diagram 
    3.1Power Controlled Stage
    The first stage (U1401) is a 20dB gain integrated circuit containing two LDMOS FET amplifier 
    stages. It amplifies the RF signal from the VCO (TXINJ). The output power of stage U1401 is 
    controlled by a DC voltage applied to pin 1 from the power control circuit (U1503 pin 4, with 
    transistors Q1504-5 providing current gain and level-shifting). The control voltage simultaneously 
    varies the bias of two FET stages within U1401. This biasing point determines the overall gain of 
    U1401 and therefore its output drive level to Q1401, which in turn controls the output power of the 
    PA .
    3.2Driver Stage
    The next stage is an LDMOS device (Q1401) providing a gain of 13dB. This device requires a 
    positive gate bias and a quiescent current flow for proper operation. The voltage of the line 
    MOSBIAS_1 is set during transmit mode by the PCIC pin 24, and fed to the gate of Q1401 via 
    resistors R1402, R1447, R1449, R1458, R1459 and R1463, The bias voltage is tuned in the factory.
    The circuitry associated with U1402-2 and Q1404 limits the variation in the output power of the 
    driver stage resulting from changes in the input impedance of the final stage due to changes at the 
    Pin Diode 
    Antenna 
    Switch
    RF JackAntennaHarmonic 
    Filter
    PA - F i n a l
    StagePADriver Fr o m V COControlled
    Stage
    BIAS
    To Microprocessor
    Temperature
    Sense DC AMP
    PASUPLVLTG(2 Lines)
    SPI Bus
    TXINJ
    Sense Current
    Sense Current
    ASFIC_CMPPCICINT
    24
    4295
    6
    BIAS Powe r 
    						
    							2-6THEORY OF OPERATION
    antenna of the radio. The variation in the driver’s output power is limited by controlling its DC 
    current. The driver’s DC current is monitored by measuring the voltage drop across current-sense 
    resistors R1473-6, and this voltage is compared to a reference voltage on pin 6 of U1402-2. If the 
    current through the sense resistors decreases, the circuit increases the bias voltage on the gate of 
    Q1401 via Q1404. If the current increases, then the bias voltage decreases in order to keep the 
    driver’s current constant. Since the current must increase with increasing control voltage, an input 
    path is provided to U1402-2 pin 5 from control line VCNTRL to enable this.
    3.3 Final Stage
    The final stage uses two LDMOS FET devices operating in parallel. Each device has its own 
    adjustable gate bias voltage, MOSBIAS_2 and MOSBIAS_3, obtained from D/A outputs of the 
    ASFIC. These bias voltages are also factory-tuned. If these transistors are replaced, the bias 
    voltage must be tuned using the Tuner Software. Care must be taken not to damage the device by 
    exceeding the maximum allowed bias voltage. The device’s drain current is drawn directly from the 
    radio’s DC supply voltage input, PASUPVLTG, via current-measurement resistor R1409.
    A matching network combines the output of the two devices and provides a 50-ohm source for the 
    antenna switch and harmonic filter.
    3.4 Antenna Switch
    The antenna switch is operated by the 9T1 voltage source which forward biases diodes D1401 and 
    D1402 during transmit, causing them to appear as a low impedance. D1401 allows the RF output 
    from final stages Q1402 and Q1403 to be applied to the input of the low-pass harmonic filter 
    (L1421-3 and associated components). D1402 appears as a short circuit at the input of the receiver 
    (RXINJ), preventing transmitter RF power from entering the receiver. L1420 and C1456 appear as a 
    broadband _-wave transmission line, making the short circuit presented by D1402 appear as open 
    circuit at the junction of D1401 and the harmonic filter input.
    During receive mode, the 9T1 voltage is not present, and D1401 and D1402 do not conduct and 
    appear as open circuits. This allows signals from the antenna jack to pass to the receiver input, and 
    disconnects the transmitter final stages from this path.
    3.5 Harmonic Filter
    Components L1421-L1423 and C1449-C1455 form a seven-pole elliptic low-pass filter to attenuate 
    harmonic energy of the transmitter to specifications level. R1411 is used to drain electrostatic 
    charge that might otherwise build up on the antenna. The harmonic filter also prevents high level RF 
    signals above the receiver passband from reaching the receiver circuits, improving spurious 
    response rejection.
    3.6 Power Control
    The transmitter uses the Power Control IC (PCIC, U1503) to control the power output of the radio. A 
    differential DC amplifier U1502-1 compares the voltage drop across current-measuring resistor 
    R1409, which is proportional to the transmitter final stage DC current, with the voltage drop across 
    resistor R1508 and R1535, which is proportional to the current through transistor Q1503. This 
    transistor is controlled by the output of the differential amplifier, which varies the transistor Q1503. 
    This transistor is controlled by the output of the differential amplifier, which varies the transistor  
    						
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