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Sony Dej011 Service Manual

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    							PORTABLE CD PLAYER
    E Model
    SPECIFICATIONS
    D-EJ011
    Ver. 1.0  2006.12
    Model Name Using Similar Mechanism D-EJ010
    CD Mechanism Type CDM-3525A
    Optical Pick-up Name DAX-25E
    9-887-511-012006L02-1
    © 2006.12
    Sony Corporation
    Pe rsonal Audio Division
    Published by Sony Techno Create Corporation
    SERVICE MANUAL
    System:  Compact disc digital audio system
    Laser diode properties
    Emission duration: Continuous
    Laser output: Less than 44.6  µW (This output is the
    value measured at a distance of 200 mm from the
    objective lens surface on the optical pick-up block
    with 7 mm aperture.)
    Power requirements
    • Two LR6 (size AA) batteries: 1.5 V DC  × 2
    Dimensions (w/h/d) (without projecting parts and controls)
    Approx. 139.8  × 27.9  × 139.8 mm
    Mass (excluding accessories)
    Approx.188 g
    Operating temperature  5°C - 35 °C (41 °F - 95 °F)Battery life* (approx. hours)
    (When the CD player is used on a flat and stable
    place.)
    Playing time varies depending on how the CD player
    is used.G-PROTECTION G-on G-off
    T wo Sony alkaline batteries LR6 (SG)
    (produced in Japan)   16   11
    * Measured value by the standard of JEITA (Japan
    Electronics and Information Technology Industries
    Association).
    • The indicator sections of  
      roughly show the
    remaining battery power. One section does not
    always indicate one-fourth of the battery power.
    Design and specifications are subject to change
    without notice.
    Supplied accessories
    Headphones (1) 
    						
    							2
    D-EJ011
    Notes on chip component replacement• Never reuse a disconnected chip component.
    • Notice that the minus side of a tantalum capacitor may be
    damaged by heat.
    Flexible Circuit Board Repairing • Keep the temperature of the soldering iron around 270 ˚C
    during repairing.
    • Do not touch the soldering iron on the same conductor of the
    circuit board (within 3 times).
    • Be careful not to apply force on the conductor when soldering
    or unsoldering.
    CAUTION
    Use of controls or adjustments or performance of procedures
    other than those specified herein may result in hazardous radiation
    exposure.T ABLE OF CONTENTS
    1. SERVICING NOTES
    ................................................ 3
    2. GENERAL................................................................... 3
    3. DISASSEMBLY
    3-1. Disassembly Flow ........................................................... 4
    3-2. Cabinet (Inner) Assy,
    Cabinet (Lower) Assy ...................................................... 4
    3-3. Optical Pick-up (CDM-3525A), MAIN Board .................................................................... 5
    4. ELECTRICAL ADJUSTMENT............................. 6
    5. DIAGRAMS
    5-1. Block Diagram ................................................................ 8
    5-2. Printed Wiring Board– Main Board (Side A) – ................................................. 9
    5-3. Printed Wiring Board – Main Board (Side B), Jack Board – ............................. 10
    5-4. Schematic Diagram  – Main Board (1/2) – ..................... 11
    5-5. Schematic Diagram  – Main Board (2/2), Jack Board – . 12
    5-6. IC Pin Function Description ............................................ 15
    6. EXPLODED VIEWS................................................. 17
    7. ELECTRICAL PARTS LIST.................................. 18
    SAFETY-RELATED  COMPONENT  WARNING!!
    COMPONENTS  IDENTIFIED  BY  MARK   0  OR  DOTTED  LINE
    WITH  MARK   0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
    THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
    REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
    PA RT   NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
    IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
    UNLEADED SOLDER
    Boards requiring use of unleaded solder are printed with the lead-
    free mark (LF) indicating the solder contains no lead.
    (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)
    : LEAD FREE MARK
    Unleaded solder has the following characteristics.
    • Unleaded solder melts at a temperature about 40  °C higher
    than ordinary solder.
    Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time.
    Soldering irons using a temperature regulator should be set to about 350  °C.
    Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
    • Strong viscosity
    Unleaded solder is more viscou-s (sticky, less prone to flow)
    than ordinary solder so use caution not to let solder bridges
    occur such as on IC pins, etc.
    • Usable with ordinary solder
    It is best to use only unleaded solder but unleaded solder may
    also be added to ordinary solder. 
    						
    							3
    D-EJ011
    SECTION 1
    SERVICING NOTES
    NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
    BLOCK  OR  BASE  UNIT
    The laser diode in the optical pick-up block may suffer electrostatic
    break-down because of the potential difference generated by the
    charged electrostatic load, etc. on clothing and the human body.
    During repair, pay attention to electrostatic break-down and also
    use the procedure in the printed matter which is included in the
    repair parts.
    The flexible board is easily damaged and should be handled with
    care.
    NOTES  ON  LASER  DIODE  EMISSION  CHECK
    The laser beam on this model is concentrated so as to be focused on
    the disc reflective surface by the objective lens in the optical pick-
    up block. Therefore, when checking the laser diode emission,
    observe from more than 30 cm away from the objective lens.
    LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
    CHECK
    During normal operation of the equipment, emission of the laser
    diode is prohibited unless the upper lid is closed while turning ON
    the S811. (push switch type)
    The following checking method for the laser diode is operable.
    Fig. 1 Method to push the S811
    SECTION  2 GENERALThis section is extracted from
    instruction manual.
    LOCATING THE  CONTROLS
    • Method:
    Emission of the laser diode is visually checked.
    1. Open the upper lid.
    2. With a disc not set, turn on the S811 with a screwdriver having
    a thin tip as shown in Fig.1.
    3. Press the u button.
    4. Observing the objective lens, check that the laser diode emits light.
    When the laser diode does not emit light, automatic power
    control circuit or optical pick-up is faulty.
    In this operation, the objective lens will move up and down 2
    times along with inward motion for the focus search.
    S811
    Remaining battery power
    Sound modeTrack number
    Playing time
    Play mode
    Bookmark
    * The button has a tactile dot
    .
    ^ *(play/pause) 
    DC IN 4.5 V
    2 (headphones) jack
    p (stop)HOLD (rear)
    VOL –/+*
    Headphones
    SOUND/AVLS
    =+ /P MODE/
    OPEN
    Display 
    						
    							4
    D-EJ011SECTION 3
    DISASSEMBLY
    • This set can be disassembled in the order shown below.
    3-1. DISASSEMBLY FLOW
    3-2. CABINET (INNER) ASSY, CABINET (LOWER) ASSY
    Note: Follow the disassembly procedure in the numerical order given.
    3-2. CABINET (INNER) ASSY,
            CABINET (LOWER) ASSY            (Page 4)
    3-3. OPTICAL PICK-UP (CDM-3525A),             MAIN BOARD
                             (Page 5) SET
    4 two screws
    cabinet (inner) assy
    cabinet (lower) assy
    3 five screws
    1
    2
    5 two claws
    6 two claws 
    						
    							5
    D-EJ011
    3-3.OPTICAL PICK-UP (CDM-3525A), MAIN BOARD
    MAIN Board (side A) To / F
    rom
    Optical devic
    eCDM-3525A
    BLK
    RED
    ORGGRY
    4 MAIN board
    cabinet (lower) assy
    3 optical pick-up CDM-3525A
    1 CN501
    2 Unsolder four lead wires 
    						
    							6
    D-EJ011SECTION 4
    ELECTRICAL ADJUSTMENTS
    The CD section adjustments are done automatically in this set.
    Adjusting Procedure: 1. Perform check in the order given.
    2. Use YEDS-18 disc (Part No: 3-702-101-01) unless otherwise indicated.
    3. Power supply voltage requirement :DC4.5 V in DC IN jack.    (J401)
    VOLUME button : Minimum
    HOLD switch :OFF
    Focus bias Check
    Condition:
    • Hold the set in horizontal state.
    Connection: Procedure:
    1. Make a solder bridge to short SL801 (OPEN) on the MAIN board side B.
    2. Connect the oscilloscope to the test point TP604 (EQOUT) and TP406 (M-GND) on the MAIN board side B.
    3. Set a disc. (YEDS-18)
    4. Press the   u  button.
    5. Check the oscilloscope waveform is as shown below. A good eye pattern means that the diamond shape (   ) in the
    center of the waveform can be clearly distinguished.
    RF Signal reference Waveform (Eye Pattern)
    To  watch the eye pattern, set the oscilloscope to AC range and
    increase the vertical sensitivity of the oscilloscope for easy w atch-ing.
    6. Stop revolving of the disc motor by pressing the   x  button.
    7. SL801 is opened by taking the solder bridge.
    RF level 1.3 ± 0.2 Vp-p
    VOLT/DIV : 500 mV (With the 10 : 1 probe in use
    )TIME/DIV : 500n
    s
    (SIDE B)MAIN BOARD
    1
    25
    26 50X601
    S811
    (OPEN)
    SL801
    (OPEN)
    iJ30 1
    E
    C629 TP604
    EQ OUT C627
    C110
    R107
    R207
    R101
    C803
    R305
    L201
    R211 R111
    C612
    R602R617
    C625
    R622
    R625
    R626R618
    Q602L301L101IC602
    oscilloscope (AC range)
    +
    –
    TP604
    (EQOUT)
    SL801
    (OPEN) 
    						
    							7
    7
    D-EJ011
    D-EJ011
    Note on Printed Wiring Boards.
    • X : parts extracted from the component side.
    • Y : parts extracted from the conductor side.
    • a: Through hole.
    • f: internal component
    •
    : Pattern from the side which enables seeing.
    (The other layers patterns are not indicated.)
    • Note for Printed Wiring Boards and Schematic Diagrams
    Note on Schematic Diagrams.
    •All capacitors are in  µF unless otherwise noted.  (p: pF)
    50 WV or less are not indicated except for electrolytics
    and tantalums.
    • All resistors are in  Ω and 
    1/4
     W or less unless otherwise
    specified.
    •     f : internal tolerance.
    • C : panel designation.
    • A : B+ Line.
    • H : adjustment for repair.
    • Power voltage is dc 3 V and fed with regulated dc power
    supply from battery terminal.
    •V oltages and waveforms are dc with respect to ground
    under no-signal conditions.
    no mark : CD PLAY
    •V oltages are taken with a VOM (Input impedance 10 M Ω).
    V oltage variations may be noted due to normal produc-
    tion tolerances.
    •W aveforms are taken with a oscilloscope.
    V oltage variations may be noted due to normal produc-
    tion tolerances.
    • Circled numbers refer to waveforms.
    • Signal path.
    J : CD PLAY
    Caution:
    Pattern face side: Parts on the pattern face side seen from
    (Side B) the pattern face are indicated.
    Parts face side: Parts on the parts face side seen from
    (Side A) the parts face are indicated.
    • Indication of transistor.Note: The components identified by mark  0 or dotted line
    with mark ! are critical for safety.
    Replace only with part number specified.
    SECTION 5
    DIAGRAMS
    C
    B These are omitted.
    E
    Q
    D
    G These are omitted.
    S
    Q
    •W
    averforms
    1IC601  yj  XO
    2 V/DIV, 50  ns/DIV
    59.5 ns 4.5 Vp-p
    2IC801 
    yd XOUT4M 
    2 V/DIV, 0.1 µs/DIV
    244 ns 3.5 Vp-p 
    						
    							8
    8
    D-EJ011
    D-EJ011
    5-1. BLOCK DIAGRAM
    : CD PLAY
    • Signal Path
    3
    8079
    3
    5
    65
    1
    7722
    174
    7
    8
    15161819
    6463
    51
    6667
    242350534947483962
    272625242322
    3
    576
    9
    18
    DRIVER
    DRIVER
    DRIVER
    17
    19
    20
    23
    22
    11
    DIGITALFILTERSERVO
    SIGNAL GEN.
    RF
    SIGNAL GEN.
    OP IC
    DIGITAL SERVO
    SIGNAL GEN.
    PD
    LD
    FDOUT
    TDOUT
    SDOUT
    CLVOUT
    TRK
    FOCUS
    20CLK88
    CLK
    TRK
    SLED
    CLV
    XO
    XI
    SUBSYQ
    MCK
    DIN/DOUT
    R/W
    RESETX
    BUSY
    CLOCKOSC
    DAC
    31
    36
    21
    35
    SWITCHING
    Q404
    SWITCHINGQ403
    171615
    47-62
    19-24,27-322,3,5,6,8,9,11,12,39,
    40,42,43,45,46,48,49
    43-32
    MEMORY
    CONTROLLER
    41401-18 77-8029-32,34
    70
    LCD801
    LIQUID
    CRYSTAL DISPLAYKEY MATRIX
    XIN4M
    SUBSYQ
    21CLK
    MCK
    DIN OUT
    RW
    EE_SCL
    EE_SDA/REM_SDA XXRESET
    BUSY
    DQM
    MUTE2
    XRESET
    SEG0
       I
    SEG17
    COM1
       I
    COM4
    KEYSCAN1
       I
    KEYSCAN5
    OPEN/CLOSE
    HOLD
    REGB
    65
    DC IN
    30 DCIN
    IC801SYSTEM
    CONTROL L401
    D403 F402F401
    DDC
    LG
    PVCC
    +VBAT VG
    DDC
    L402
    L403
    VG
    38 VSYS
    37SW
    X601
    16.9344MHz RDACO
    LDACO
    Q602
    OUT1
    OUT2
    IN1
    IN2
    SDA
    SCL7WP
    8VCC
    IC301HEADPHONE AMP
    IC802EEPROM
    IC401 (2/2)DC/DC CONVERTER
    BD
    AC
    DDC
    E
    FO+
    FO-
    TRK-
    TRK+
    SLED+
    SLED-
    F
    SDIN
    VBIAS
    AMP
    10FOCUSAMP
    8 SLEDAMP
    7 CLVCLK
    TRK
    FOCUS
    VREF
    SLED CLVCLK
    AMP
    RESET
    742 XP.OFF
    OFF
    764
    MUTE34755
    MUTE1
    MUTE1
    431
    K_PLAY
    WP
    IC401 (1/2)FOCUS/TRACKING COIL DRIVE,
    SLED/SPINDLE MOTOR DRIVE
    IC602 SDRAM(16M)
    RAS
    CAS
    WE
    RASX
    A00-A11
    DQ0-15 RFI
    EQO
    CASX WEXDQ0-15 A0-11
    444546
    1436LDQM
    UDQM3534CLK
    CKE
    RCLK
    C2FX
    YFLAG RCKE
    2829
    IC601RF AMP, SERVO,
    DIGITAL SIGNAL PROCESSOR,
    SDRAM CONTROLLER,D/A CONVERTER
    J401
    DC IN 4.5V
    !
    DRY BATTERY SIZE AA
    (IEC DESIGNATION LR6) 2PCS. 3V
    J301
    i
    (SLED)FOCUS
    COIL
    (SPINDLE)M
    TRACKING COIL
    F+
    F-
    T+
    T-
    SLED+ SLED-
    DRIVER25
    24
    SPID+
    SPIN-M
    SPINDLE+
    SPINDLE-
    OPTICAL DEVICE
    (CDM-3525A)
    VCC
    +
    +
    A
    B
    C
    E F
    LD
    PD
    VC
    LD
    DRIVER Q601
    DDC
    S811
    (OPEN) S812
    HOLD
    OFF      ON S807
    APC10
    9
    D80346K_STOP
    S801
    S802
    |
    S805 S808,
    S809
    +B SWITCH Q401
    DC IN DETECT
    Q402
    L404
    L405 
    						
    							9
    9
    D-EJ011
    D-EJ011 5-2. PRINTED WIRING BOARD  – MAIN BOARD (SIDE A) –
     :Uses unleaded solder.
    •
    Semiconductor
    Location
    Ref. No.Location
    D401 E-6
    D403 D-6
    D803 D-5
    IC301 A-2
    IC601 B-4
    IC802 E-4
    Q401 D-6
    Q402 E-6
    Q403 E-7
    IC301
    IC601
    14
    85
    120 40
    60
    21
    41
    61
    80
    1
    4
    8
    5
    E
    E
    +– –+
    (SLED)
    M
    (SPINDLE)
    M
    OPTICAL DEVICE (CDM-3525A) (1/2)
    GRY
    ORG BLK
    RED
    C210
    R201 R205
    R206 R106
    R104R204
    R620
    R601R608 C613
    C614 C615
    R615 R609
    R610 C609 C611C604
    R606
    R103
    R203R616
    R105
    R304
    R619 C108
    C102
    C618
    R607
    C605
    C626
    R815
    R833
    R834 R839
    R818
    R817
    C809
    C806C808 D803
    R404 D403
    R810
    L406L407
    CN408
    CN403
    CN407
    CN404SLED
    –
    SLED+
    SPINDLE
    –
    SPINDLE+
    C405
    R407 C413 R406
    R405
    R403D401 F402
    L404
    L405
    C807
    R410
    R807
    R806
    C805
    R840
    R841
    R832
    Q401
    Q402
    Q403
    C802
    R804
    R844
    R805 R843
    IC802
    R614
    C606 R613
    L801 C202
    C201
    C624
    C208
    C306
    C303
    C630
    C620
    C101
    11
    (11)1-871-743-
    (SIDE A)BOARD
    MAIN  
    234567
    A 1
    B
    C
    D
    E
    F
    8 
    						
    							10
    10
    D-EJ011
    D-EJ011
    5-3. 
    PRINTED WIRING BOARD  – MAIN BOARD (SIDE B)  –
     :Uses unleaded solder.
    • Semiconductor
    Location
    Ref. No.Location
    D404 E-1
    IC401 D-3
    IC602 B-6
    IC801 E-4
    Q404 E-2
    Q601 C-5
    Q602 A-5
    1
    20
    21 40
    1 20
    60
    80 40
    21
    61
    41
    1
    22
    BP VL
    1
    25
    26 50
    DC  IN  4.5V
    J401
    S803.
    S802 >
    S807
    x
    S801u
    LCD801LIQUID CRYSTAL DISPLAY
    S812HOLD.
    1 2 15
    16
    OPTICAL DEVICE
    (CDM-3525A) (2/2)
    X601
    S811
    (OPEN)
    SL801
    (OPEN)
    i
    J301
    S804
    VOL– S808
    SOUND/
    AVLS
    S805
    VOL+ S809
    P MODE/
    DRY BATTERY
    SIZE AA
    (IEC DESIGNATION LR6) 2PCS. 3V
    CN401
    CN402
    OFFtON
    E
    E
    11
    (11)1-871-743-
    D404
    Q404
    C417
    C406
    R821C416 C401
    C410 C804
    C412 C403C404 L401
    C411
    C409
    F401
    CB414
    IC401 IC801
    SL803
    R828R831 R830
    CN801
    C420C408
    R414
    R415 R402 R416
    R418
    R419
    R417
    R811
    C623C628C610 C602
    C607
    C105
    C305
    C205C204
    C104
    C304
    C601 C603
    CN501
    C629
    TP604
    EQ OUT C627
    C110
    R107
    R207
    R101
    C803
    R305
    L201
    R211 R111
    C612
    R603
    R602 R617
    C625
    R622
    R625
    R626
    R618
    Q602
    R604
    Q601 L301
    L101IC602
    R812R823
    R624
    C619R829
    C811R401
    L403
    C419
    L402
    (SIDE B)MAIN BOARD  
    23456781
    B A
    C
    D
    E
    F 
    						
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