Sony Vaio Pcg Serie Pcg Fx210 Manual

							Confidential
PCG-FX210
US Model
Canadian ModelSERVICE MANUAL
NOTEBOOK COMPUTER
9-872-204-11
S400 
						

							— 2 —PCG-FX210 (UC) Information in this document is subject to change without notice.
Sony and VAIO are trademarks of Sony. Intel logo and Intel Inside
logo are registered trademarks of Intel Corporation. Pentium MMX
is a trademark of Intel Corporation. Microsoft, MS-DOS, Windows,
the Windows 95 and Windows 98 logo are trademarks of Microsoft
Corporation.
All other trademarks are trademarks or registered trademarks of
their respective owners. Other trademarks and trade names may be
used in this document to refer to the entitles claiming the marks and
names or their produces. Sony Corporation disclaims any proprietary
interest in trademarks and trade names other than its own.
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions.  Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages.  Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the 0 mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when mounting
parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board.  In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts.  When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition.  Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components.  Also remember that the negative side of tantalum
capacitors is easily damaged by heat.
6.  When handling flexible print boards...
• The temperature of the soldering-iron tip should be about 270C.
• Do not apply the tip more than three times to the same pattern.
• Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration.  Always handle with care.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer.  Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this device may present a fire
or chemical burn hazard if mistreated.  Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
CAUTION: Changing the back up battery.
• Overcharging, short circuiting, reverse charging, multilation or
incineration of the cells must be avoided to prevent one or more of
the following occurrences; release of toxic materials, release of
hydrogen and/or oxygen gas, rise in surface temperature.
• If a cell has leaked or vented, it should be replaced immediately
while avoiding to touch it without any protection.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Confidential 
						

							— 3 —
TABLE OF CONTENTS
CHAPTER 1. REMOVAL
1-1. Flowchart ......................................................................... 1-1
1-2. Main Electrical Parts Location Diagram ......................... 1-1
1-3. Removal ........................................................................... 1-2
1. Hood Keyboard Assy, Keyboard Unit .............................. 1-2
2. Cooling Unit-2, Lithium Battery, DVD-ROM Drive ....... 1-2
3. HDD, Door Battery .......................................................... 1-3
4. Palm Rest Assy, Touch Pad, CNX-129 Board,
Palm Rest Plate, Bracket Pad ........................................... 1-3
5. Display Assy, Hinge Cover .............................................. 1-4
6. PWS-14  Board, Latch Detector ...................................... 1-5
7. PC Card Connector, Modem Card, MBX-50 Board,
I/O Bracket ....................................................................... 1-5
8. Speaker Unit, SWX-74 Board ......................................... 1-6
9. SO-DIMM ........................................................................ 1-6
10. Modem Card (Removing from the bottom) ..................... 1-7
11. LCD Section – Made by AC –......................................... 1-8
1. Bezel Housing Assy (14.1 inch) .................................. 1-8
2. Bracket LCD Left, Bracket LCD Right,
LCD Unit (14.1 inch) ................................................... 1-9
3. FPC, Inverter Assy, Display Housing Assy,
LCD Harness ................................................................ 1-9
1-4. Replacing the CPU ........................................................ 1-10
1. Removing the CPU ........................................................ 1-10
2. Installing the CPU .......................................................... 1-10
1-5. Replacing Various Connector on the MBX-50 Board ... 1-11
1. Removing the I/O Bracket ............................................. 1-11
2. Removing the Various Connectors ................................ 1-11
1-6. DIP Switch Setting of the MBX-50 Board .................... 1-12
(to 1-12)
SectionTitlePage
•Abbreviations
UC : US model / Canadian model
PCG-FX210 (UC)
Confidential
SectionTitlePage
CHAPTER 2. SELF DIAGNOSTICS.......................... 2-1
(to 2-1)
CHAPTER 3. BLOCK DIAGRAM............................... 3-1
(to 3-2)
CHAPTER 4. FRAME HARNESS DIAGRAM........ 4-1
(to 4-2)
CHAPTER 5. EXPLODED VIEWS AND
PARTS LIST
............................................ 5-1
5-1. Main Section .................................................................... 5-2
5-2. LCD Section – Made by AC –......................................... 5-5
5-3. Connector Section ............................................................ 5-7
(to 5-8) 
						

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PCG-FX210 (UC)
CHAPTER 1.
REMOVAL
1-1. Flowchart
• P XX means pages that appears in this manual.
• Remember that hard disk drives are easily damaged by vibration.  Always handle with care.
1-2. Main Electrical Parts Location Diagram
POWER
OFFHOOD
KEYBOARD
ASSY
SO-DIMM 
BATTERY
PA C K
MODEM
CARD
KEYBOARD
UNIT
P 1-2 P 1-2
P 1-6 P 1-6
P 1-6P 1-4
P 1-7P 1-3P 1-2
P 1-5
P 1-5PALM REST
ASSY
P 1-2
P 1-3P 1-3
COOLING
UNIT-2
PC CARD
CONNECTOR
FDD
SPEAKER
UNITDOOR
BATTERY
SWX-74
BOARD
P 1-4
DISPLAY
ASSY
P 1-2
LITHIUM
BATTERY
P 1-5
FPC
INVERTER
ASSY
BRACKET
LCD LEFT
BRACKET
LCD RIGHT
DISPLAY
HOUSING
ASSYBEZEL
HOUSING
ASSY
DVD-ROM
DRIVE
LCD
UNIT
PWS-14
BOARD
P 1-5
P 1-5
HDDP 1-8 P 1-9 P 1-9 P 1-9
P 1-9
P 1-9
P 1-9
P 1-9
LCD
HARNESS
P 1-3
PALM REST
PLATE
P 1-3
BRACKET
PA D
P 1-3TOUCH
PA D
CNX-129
BOARD
P 1-3
MODEM
CARD
LATCH
DETECTORI/O
BRACKETMBX-50
BOARD
P 1-5
HINGE
COVER
LCD Unit
Inverter Assy
Speaker Unit
DVD-ROM Drive
PWS-14 Board
FD Drive CNX-129 Board MBX-50 BoardSpeaker Unit
Cooling Unit-2
HDD
SWX-74 Board
Touch PadModem Card 
						

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PCG-FX210 (UC)
1-3.Removal
1. Hood Keyboard Assy, Keyboard Unit
2. Cooling Unit-2, Lithium Battery, DVD-ROM Drive
Five Claws
6DVD-ROM Door Assy 7DVD-ROM Drive5Bracket CD-ROM R
2Bracket (CD-ROM L) 7Cooling Unit-2
q; 5Rotate the three screws that are built together 
with the Cooling Unit-2.
3+B M2 (X2) (Silver)
9+B M2 (Silver) 2+B M2 (X2)
    (Silver)
3Plate ground
    (SH)
MBX-50
Board CON4
qaLithium
    Battery
Lithium
Battery
Four
Claws 1+B M2 (X2) (Silver)4+B M2 (X2)
    (Silver)
8 4 1
MBX-50 Board
CON146
6Hood Keyboard Assy
7
95 q;Keyboard Unit
Four Claws
MBX-50 Board
CON21 MBX-50 Board
CON15 3M2X4 Special Head (Black)
8M2X4 Special Head (Black)
1
2 4Pull it up sliding it to the right. 
						

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PCG-FX210 (UC)
3. HDD, Door Battery
4. Palm Rest Assy, Touch Pad, CNX-129 Board, Palm Rest Plate, Bracket Pad
3
2FPC 50Pin
    (for HDD)
4Door Battery 1M2X6 Special Head (X6) (Gold)
1Screw M3X4 (X2) (Gold)
2Screw M3X4 (X2) (Gold)3Bracket HDD
4FPC 50Pin
    (for HDD) 5HDD
MBX-50 Board
CON9
Palm Rest Assy
1M2X4
Special Head
(Black)
43Pull it to the front slightly
    and raise to remove it.
1M2X4 Special
Head (x4) (Black)
5Bracket Pad
9Touch Pad
8FPC (TP-CNX)
6FPC (SWX-PWX)
3Palm Rest
Plate
2
Move down the front 
portion slightly downward
and then pull it out.
4Remove by pressing 
to rear.
7CNX-129
Board
2Screw (M2), 
    0 Number P3 Kind (X4) (Black)PWS-14 Board
BCN2 
						

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PCG-FX210 (UC)
5. Display Assy, Hinge Cover
qdClose simultaneously both left and right hinges approximately 90°
  in the direction of the arrow.
Note : To remove the cover hinge, bend
slightly the center of the display
base facilitates the removal work.Four ClawsqfCover Hinge
qhDisplay Base
qg
Display Assy1Stand the LCD upright  
to the MBX-50 board.
qaM2X6 Special
    Head (Gold)
8Screw (M2), 0 Number P3 Kind (Black) 9M2X6 Special Head (X2) (Gold)
5M2.6 Cross
    (Hole) Bind
(Black)7M2.6 Cross
    (Hole) Bind
       (Black)
qs 2
6M2.6 Cross (Hole)
    Bind (X2) (Black) q;+B 2X12 (Silver) 3+B M2 (X2) (Gold)
Six Claws
MBX-50 Board
CON4
4Plate ground
    (SH) 
						

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PCG-FX210 (UC)
6. PWS-14  Board, Latch Detector
7. PC Card Connector, Modem Card, MBX-50 Board, I/O Bracket
∗1 When removing the CPU, refer to “ 1-4. Replacing the CPU ”.
∗2 Modem card can be removed from the bottom.
Refer to the subsequent paragraph “ 10. Modem card ” for more details.
6PWS-14 Board
3 5Latch Detector
4Two Claws 12M2X4 Special Head (X2) (Black)
MBX-50 Board CON22
qlMBX-50 Board qaPC Card Connector
qsM2 Grip (X2) (Black) q;+B 2X14 (X2)
(Silver)4+B 2X4 (Silver)
5Screw (MBX)
(Silver)qkI/O Bracket
qjScrew (HEX) (X6) (Silevr)
9qd
7Bracket Bay Connector 6M2X4 Special Head
    (X2) (Black)
CON4
qfModem Card*
2
qgNUT M2
TYPE2 (X2)
CPU*1
3M2X4 Special Head
 (X4) (Black)1M2X6 Special Head (Gold)
2Bracket wire
8Screw (M2) 0 Number 
P3 Kind (X2) (Black)qhSpacer
(MBX) (X2) 
						

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PCG-FX210 (UC)
8. Speaker Unit, SWX-74 Board
9. SO-DIMM
9Speaker Unit
Speaker Unit
Hood Keyboard
Hood
Keyboard 5SWX-74 Board7Speaker Unit4M2X4 (X5) (Black)
3
1
28M2X4 (X2) (Black) 6M2X4 (X2) (Black)
SWX-74 Board
JP1
SWX-74 Board
JP2
SWX-74 Board
JP3
Projection
Projection Notch
Note : When removing the speaker 
unit, be sure not to damage 
the hood keyboard.
Note : To re-install it, align the notch
of the speaker unit with the 
projection of the hood keyboard.
Notch
ba
a a → b2DIMM Door1M2X4
    Special Head (Black)
Removal of SO-DIMM 
						

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PCG-FX210 (UC)
10. Modem Card (Removing from the bottom)
2Modem Door
4Modem Card1M2X4 Special Head (Black)
3M2 Grip (X2) (Black)
5