Motorola Cdm And Pro Series Detailed 68p81091c63 O Manual

							Theory of Operation2-37
2.11 Control Head (PRO5100, PRO7100, CDM1250, CDM1550)
The control head contains the internal speaker, the on/off/volume knob, the microphone connector, 
several buttons to operate the radio, several indicator light emitting diodes (LEDs) to inform the user 
about the radio status, and a 14 character liquid crystal display (LCD) for alpha - numerical 
information, e.g. channel number or call address name. To control the LED’s and the LCD, and to 
communicate with the host radio the control head uses the Motorola 68HC11E9 µP.
2.11.1 Power Supplies
The power supply to the control head is taken from the host radio’s FLT A+ voltage via connector 
J0801 pin 3 and the regulated +5V via connector J0801 pin 7. The voltage FLT A+ is at battery level 
and is used for the LED’s, the back light and to power up the radio via on / off / volume knob. The 
stabilized +5 volt is used for the µP, display, display driver, and keypad buttons. The voltage USW 5V 
derived from the FLT A+ voltage and stabilized by the series combination of R0822, VR0822 is used 
to buffer the internal RAM of the µP (U0831). C0822 allows the battery voltage to be disconnected 
for a couple of seconds without losing RAM parameters. Dual diode D0822 prevents radio circuits 
from discharging this capacitor. When the supply voltage is applied to the radio, C0822 is charged 
via R0822 and D0822. To avoid that the µp enters the wrong mode when the radio is switched on 
while the voltage across C0822 is still too low, the regulated 5V charge C0822 via diode D0822.
2.11.2 Power On / Off
The on/off/volume knob when pressed switches the radio’s voltage regulators on by connecting line 
ON OFF CONTROL to line UNSW 5V via D0821. Additionally, 5 volts at the base of digital transistor 
Q0822 informs the control head’s µP about the pressed knob. The µP asser ts pin 62 and line CH 
REQUEST low to hold line ON OFF CONTROL at 5 volts via Q0823 and D0821. The high line ON 
OFF CONTROL also informs the host radio, that the control head’s µP wants to send data via SBEP 
bus. When the radio returns a data request message, the µP informs the radio about the pressed 
knob. If the radio was switched off, the radio’s µp switches it on and vice versa. If the on/off/volume 
knob is pressed while the radio is on, the software detects a low state on line ON OFF SENSE, the 
radio is aler ted via line ON OFF CONTROL and sends a data request message. The control head µp 
will inform the radio about the pressed knob and the radio’s µp switches the radio off.
2.11.3 Microprocessor Circuit
The control head uses the Motorola 68HC11E9 microprocessor (µp) (U0831) to control the LED’s 
and the LCD and to communicate with the host radio. RAM and ROM are contained within the µP 
itself.
The µP generates it’s clock using the oscillator inside the µP along with a 8 MHz ceramic resonator 
(U0833) and R0920.
The µP’s RAM is always powered to maintain parameters such as the last operating mode. This is 
achieved by maintaining 5 volts at µp, pin 25. Under normal conditions, when the radio is off, USW 
5V is formed by FLT A+ running to D0822. C0822 allows the battery voltage to be disconnected for a 
couple of seconds without losing RAM parameters. Diode D0822 prevents radio circuits from 
discharging this capacitor.
There are eight analog-to-digital converter por ts (A/D) on the µp. They are labeled within the device 
block as PE0-PE7. These lines sense the voltage level ranging from 0 to 5V of the input line and 
conver t that level to a number ranging from 0 to 255 which can be read by the software to take 
appropriate action.
Pin VRH is the high reference voltage for the A/D por ts on the µP. If this voltage is lower than +5V the 
A/D reading is incorrect. Likewise pin VRL is the low reference for the A/D por ts. This line is normally 
tied to ground. If this line is not connected to ground, the A/D readings could be incorrect. 
						

							2-38Theory of Operation
The µP determines the used keypad type and the control head ID by reading the levels at ports PC0 
– PC7. Connections JU0852/3/4 are provided by the individual keypads.
The MODB / MODA input of the µP must be at a logic 1 for it to star t executing correctly. The XIRQ 
and the IRQ pins should also be at a logic 1.
Voltage sense device U0832 provides a reset output that goes to 0 volts if the regulated 5 volts goes 
below 4.5 volts. This is used to reset the controller to prevent improper operation.
2.11.4 SBEP Serial Interface
The host radio (master) communicates to the control head µP (slave) through its SBEP bus. This bus 
uses only line BUS+ for data transfer. The line is bi-directional, meaning that either the radio or the 
control head µP can drive the line. The µP sends serial data via pin 50 and D0831 and it reads serial 
data via pin 47. Whenever the µP detects activity on the BUS+ line, it star ts communication.
When the host radio needs to communicate to the control head µP, it sends data via line BUS+. Any 
transition on this line generates an interrupt and the µP star ts communication. The host radio may 
send data like display information, LED and back light status or it may request the control head ID or 
the keypad ID.
When the control head µP wants to communicate to the host radio, the µP brings request line CH 
REQUEST to a logic 0 via µP, pin 62. This switches on Q0823, which pulls line ON OFF CONTROL 
high through diode D0821. A low to high transition on this line informs the radio, that the control head 
requires service. The host radio then sends a data request message via BUS+ and the control head 
µP replies with the data it wanted to send. This data can be information such as a key is pressed or 
the volume knob rotated.
The control head µP monitors all messages sent via BUS+, but ignores any data communication 
between host radio and CPS or Universal Tuner.
2.11.5 Keypad Keys
The control head keypad is a 6-key keypad (Model B) or a 10- key keypad (model C). All keys are 
configured as two analog lines read by µP, pins 13 and 15. The voltage on the analog lines varies 
between 0 volts and +5 volts depending on which key has been pressed. If no key is pressed, the 
voltage at both lines is 5 volts. The key configuration can be thought of as a matrix, where the two 
lines represent one row and one column. Each line is connected to a resistive divider powered by +5 
volts. If a button is pressed, it will connect one specific resistor of each divider line to ground level 
and thereby reduce the voltages on the analog lines The voltages of the lines are A/D conver ted 
inside the µP (por ts PE 0 - 1) and specify the pressed button. To determine which key is pressed, the 
voltage of both lines must be considered.
An additional pair of analog lines and A/D µP ports (PE 3 – 2) is available to support a keypad 
microphone, connected to the microphone connector J0811. Any microphone key press is processed 
the same way as a key press on the control head.
2.11.6 Status LED and Back Light Circuit
All the indicator LED’s (red, yellow, green) are driven by current sources. To change the LED status 
the host radio sends a data message via SBEP bus to the control head µP. The control head µP 
determines the LED status from the received message and switches the LED’s on or off via por t PB 
7 – 0 and port PA4. The LED status is stored in the µP’s memory. The LED current is determined by 
the resistor at the emitter of the respective current source transistor.
The back light for the LCD and the keypad is controlled by the host radio the same way as the 
indicator LED’s using µP por t PA 5. This port is a Pulse Width Modulator (PWM) output. The output 
signal charges capacitor C0843 through R0847. By changing the pulse width under software control, 
the dc voltage of C0843 and thereby, the brightness of the back light can be changed in four steps.  
						

							Theory of Operation2-39
The keypad back light current is drawn from the FLT A+ source and controlled by transistor Q0933. 
The current flowing through the LED’s cause a proportional voltage drop across the parallel resistors 
R0947, R0948. This voltage drop is amplified by the op-amp U0931-2. U0931-2 and Q0934 form a 
differential amplifier. The voltage difference between the base of Q0934 and the output of U0931-2 
determines the current from the base of the LED control transistor Q0933 and in turn the brightness 
of the LED’s. The µP controls the LED’s by changing the dc level at the base of Q0934. If the base of 
Q0934 is at ground level, Q0934 is switched off and no current flows through Q0933 and the LED’s. 
If the base voltage of Q0934 rises a current flows through Q0934 and in turn through Q0933 causing 
the LED’s to turn on and a rising voltage drop across R0947, R0948. The rising voltage causes the 
output of the op-amp to rise and to reduce the base to emitter voltage of Q0934. This decreases the 
current of Q0933 until the loop has settled.
2.11.7 Liquid Crystal Display (LCD)
The LCD H0971 uses the display driver U0971. The display is a single-layer super-twist pneumatic 
(STN) LCD display. It has 14 characters with a 5*8 dot matrix for displaying alpha - numerical 
information and a line with 21 pre - defined icons above the dot matrix
The driver contains a data interface to the µP, an LCD segment driver, an LCD power circuit, an 
oscillator, data RAM and control logic. At power up the driver’s control logic is reset by a logic 0 at 
input SR2 (U0971-15). The driver’s internal oscillator is set to about 20 kHz and can be measured at 
pin 22. The driver’s µP interface is configured to accept 8 bit parallel data input (U0971-D0-D7) from 
the control head µP (U0831 por t PC0-PC7).
To write data to the driver’s RAM the µP sets chip select (U0971-20) to logic 0 via U0831-11, RD 
(U0971-18) to logic 1 via (U0831-10) and WR (U0971-17) to logic 0 via U0831-9. With input A0 
(U0971-21) set to logic 0 via U0831-12 the µP writes control data to the driver. Control data includes 
the RAM star t address for the following display data. With input A0 set to logic 1 the µP then writes 
the display data to the display RAM. When data transfer is complete the µP terminates the chip 
select, RD, and WD activities.
The display driver’s power circuit provides the voltage supply for the display. This circuit consists of a 
voltage multiplier, voltage regulator and a voltage follower. The external capacitors C0971 - C0973 
configure the multiplier to double the supply voltage. In this configuration the multiplier output VOUT 
(U0971-8) supplies a voltage of -5V (2* -5V below VDD). The multiplied voltage VOUT is sent to the 
internal voltage regulator. To set the voltage level of the regulator output V5 (U0971-5) this voltage is 
divided by the resistors R0973 and R0974 and fed back to the reference input VR (U0971-6). In 
addition the regulator output voltage V5 can be controlled electronically by a control command sent 
to the driver. With the used configuration the voltage V5 is about –2V. The voltage V5 is resistively 
divided by the driver’s voltage follower to provide the voltages V1 - V4. These voltages are needed 
for driving the liquid crystals. The level of V5 can be measured by one of the µP’s analog-to-digital 
conver ters (U0831-20) via resistive divider R0975, R0976. To stabilize the display brightness over a 
large temperature range the µP measures the temperature via analog-to-digital converter (U0831-
18) using temperature sensor U0834. Dependent on the measured temperature the µP adjusts the 
driver output voltage V5, and in turn the display brightness, via parallel interface.
2.11.8 Microphone Connector Signals
Signals BUS+, PTT IRDEC, HOOK, MIC, HANDSET AUDIO, FLT A+, +5V and 2 A/D conver ter 
inputs are available at the microphone connector J0811. Signal BUS+ (J0811-7) connects to the 
SBEP bus for communication with the CPS or the Universal Tuner. Line MIC (J0811-5) feeds the 
audio from the microphone to the radio’s controller via connector J0801-4. Line HANDSET AUDIO 
(J0811-8) feeds the receiver audio from the controller (J0801-6) to a connected handset. FLT A+, 
which is at supply voltage level, and +5V are used to supply any connected accessory like a 
microphone or a handset. 
						

							2-40Theory of Operation
The two A/D converter inputs (J0811-9/10) are used as a microphone with keypad. A pressed key 
changes the dc voltage on both lines. The voltages depend on which key is pressed. The µP 
determines, from the voltage on these lines, which key is pressed and sends this information to the 
host radio.
Line PTT IRDEC (J0811-6) is used to key up the radio’s transmitter. While the PTT button on a 
connected microphone is released, line PTT IRDEC line is pulled to a +5 volts level by R0843. 
Transistor Q0843 is then switched on causing a low at µP por t PA2. When the PTT button is pressed, 
signal PTT IRDEC is pulled to ground level. This switches off Q0843 and the resulting high level at 
µP port PA2 informs the µP about the pressed PTT button. The µP informs the host radio about any 
status change on the PTT IRDEC line via the SBEP bus.
When line PTT IRDEC is connected to FLT A+ level, transistor Q0821 is switched on through diode 
VR0821 pulling the level on the line ON OFF CONTROL to FLT A+ level. This switches on the radio 
and puts the radio’s µP in bootstrap mode. Bootstrap mode is used to load the firmware into the 
radio’s flash memory.
The HOOK input (J0811-3) is used to inform the µP when the microphone´s hang-up switch is 
engaged. Dependent on the CPS programming the µP may take actions like turning the audio PA on 
or off. While the hang up switch is open, line HOOK is pulled to +5 volts level by R0841. Transistor 
Q0841 is switched on causing a low at µP por t PA1. When the HOOK switch is closed, signal HOOK 
is pulled to ground level. This switches off R0841 and the resulting high level at µP por t PA1 informs 
the µP about the closed hang up switch. The µP informs the host radio about any status change on 
the HOOK line via SBEP bus.
2.11.9 Speaker
The control head contains a speaker for the receiver audio. The receiver audio signal from the 
differential audio output of the audio amplifier located on the radio’s controller is fed via connector 
J0801-10, -11 to the speaker connector P0801, pins 1 and 2. The speaker is connected to the 
speaker connector P0801. The control head speaker can only be disconnected if an external 
speaker, connected on the accessory connector, is used.
2.11.10Electrostatic Transient Protection
Electrostatic transient protection is provided for the sensitive components in the control head by 
diodes VR0811 VR00812 and VR0816 - VR0817. The diodes limit any transient voltages. The 
associated capacitors provide radio frequency interference (RFI) protection. 
						

							3-1
Chapter 3
Maintenance
3.1 Introduction
This chapter of the manual describes:
nPreventive maintenance
nSafe handling of CMOS and LDMOS devices
nRepair procedures and techniques
3.2 Preventive Maintenance
The radios do not require a scheduled preventive maintenance program; however, periodic visual 
inspection and cleaning is recommended.
3.2.1 Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches 
are functional. It is not recommended to inspect the interior electronic circuitry.
3.2.2 Cleaning
The following procedures describe the recommended cleaning agents and the methods to be used 
when cleaning the external and internal surfaces of the radio. External surfaces include the front 
cover, housing assembly, and battery case. These surfaces should be cleaned whenever a periodic 
visual inspection reveals the presence of smudges, grease, and/or grime.
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild 
dishwashing detergent in water. The only factory recommended liquid for cleaning the printed circuit 
boards and their components is isopropyl alcohol (70% by volume).
CAUTION: The effects of certain chemicals and their vapors can have harmful results on certain plas-
tics. Aerosol sprays, tuner cleaners, and other chemicals should be avoided.
Cleaning External Plastic Surfaces
The detergent-water solution should be applied sparingly with a stiff, non-metallic, short-bristled 
brush to work all loose dir t away from the radio. A soft, absorbent, lintless cloth or tissue should be 
used to remove the solution and dry the radio. Make sure that no water remains entrapped near the 
connectors, cracks, or crevices.
Cleaning Internal Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff, non-metallic, shor t-bristled brush to dislodge embedded 
or caked materials located in hard-to-reach areas. The brush stroke should direct the dislodged 
material out and away from the inside of the radio. Make sure that controls or tunable components 
are NOTE
Internal surfaces should be cleaned only when the radio is disassembled for
servicing or repair.
!
W A R N I N G
! 
						

							3-2Maintenance
not soaked with alcohol. Do not use high-pressure air to hasten the drying process since this could 
cause the liquid to collect in unwanted places. Upon completion of the cleaning process, use a soft, 
absorbent, lintless cloth to dry the area. Do not brush or apply any isopropyl alcohol to the frame, 
front cover, or back cover.
3.3 Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios. CMOS 
characteristics make them susceptible to damage by electrostatic or high voltage charges. Damage 
can be latent, resulting in failures occurring weeks or months later. Therefore, special precautions 
must be taken to prevent device damage during disassembly, troubleshooting, and repair.
Handling precautions are mandatory for CMOS circuits and are especially impor tant in low humidity 
conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS CAUTION 
paragraph in the Disassembly and Reassembly section of the manual.
CAUTION: This radio contains static-sensitive devices. Do not open the radio unless you are properly 
grounded. Take the following precautions when working on this unit:
nStore and transpor t all CMOS devices in conductive material so that all exposed leads are 
shor ted together. Do not inser t CMOS devices into conventional plastic “snow” trays used for 
storage and transportation of other semiconductor devices.
nGround the working surface of the service bench to protect the CMOS device. We recom-
mend using the Motorola Static Protection Assembly (par t number 0180386A82), which 
includes a wrist strap, two ground cords, a table mat, and a floor mat.
nWear a conductive wrist strap in series with a 100k resistor to ground. (Replacement wrist 
straps that connect to the bench top covering are Motorola par t number RSX-4015.)
nDo not wear nylon clothing while handling CMOS devices.
nDo not insert or remove CMOS devices with power applied. Check all power supplies used for 
testing CMOS devices to be certain that there are no voltage transients present.
nWhen straightening CMOS pins, provide ground straps for the apparatus used.
nWhen soldering, use a grounded soldering iron.
nIf at all possible, handle CMOS devices by the package and not by the leads. Prior to touching 
the unit, touch an electrical ground to remove any static charge that you may have accumu-
lated. The package and substrate may be electrically common. If so, the reaction of a dis-
charge to the case would cause the same damage as touching the leads.
3.4 General Repair Procedures and Techniques
Parts Replacement and Substitution
When damaged parts are replaced, identical par ts should be used. If the identical replacement 
component is not locally available, check the parts list for the proper Motorola part number and order
the component from the nearest Motorola Communications par ts center listed in the Piece Par ts 
Availability section of this manual (See Chapter 1). You also need to review Motorola’s Rework and 
Repair Technical Reference manual, P/N 6880309G53, which can be ordered from AAD at 1-800-
422-4210.
Rigid Circuit Boards
The family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not 
accessible, some special considerations are required when soldering and unsoldering components.  NOTE
Always use a fresh supply of alcohol and a clean container to prevent contamination
by dissolved material (from previous usage).
!
W A R N I N G
! 
						

							Maintenance3-3
The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, care 
should be exercised to avoid pulling the plated circuit out of the hole.
When soldering near the 20-pin and 40-pin connectors:
nAvoid accidentally getting solder in the connector.
nBe careful not to form solder bridges between the connector pins.
nClosely examine your work for shor ts due to solder bridges.
nDo not exceed 210 degrees C when reworking boards.
nDo not exceed 5 degrees temperature ramp rate.
Flexible Circuits
The flexible circuits are made from a different material than the rigid boards and different techniques 
must be used when soldering. Excessive prolonged heat on the flexible circuit can damage the 
material. Avoid excessive heat and excessive bending.
For parts replacement, use the ST-1087 R1319A Temperature-Controlled Solder Station with a 600-
700 degree tip for OMPAC (BGA) CSP, micro BGA and connectors. Use digital tweezers for all other 
component. Use small diameter solder such as ST-633. The smaller size solder will melt faster and 
require less heat to be applied to the circuit.
To replace a component on a flexible circuit:
1. Grasp the edge of the flexible circuit with seizers (hemostats) near the par t to be removed.
2. Pull gently.
3. Apply the tip of the soldering iron to the component connections while pulling with the seizers.
Chip Components
Use either the RLN-4062 R1319A Chipmaster Hot-Air Repair Station or the Motorola 0180381B45 
Repair Station R1364a digital heated tweezer system for chip component replacement. When using 
the 0180381B45 Repair Station, select the TJ-65 mini-thermojet hand piece. On either unit, adjust 
the temperature control to 700 degrees F. (370 degrees C), and adjust the airflow to a minimum 
setting. Airflow can vary due to component density.
To remove a chip component:
1. Use a hot-air hand piece and position the nozzle of hand piece R1319A approximately 1/8 (0.3 
cm) above the component to be removed.
2. Begin applying the hot air. Once the solder reflows, remove the component using the pair of twee-
zers contained in the SMD tool kit shipped with the R1319A.
3. Using a solder wick (Motorola P/N 6680334B25) and a soldering iron or a power desoldering sta-
tion, remove the excess solder from the pads.
To replace a chip component using a soldering iron:
1. Select the appropriate micro-tipped soldering iron and apply fresh solder paste (Motorola P/N 
6680333E72) to one of the solder pads.
2. Using a pair of tweezers, position the new chip component in place while heating the fresh solder.
3. Once solder wicks onto the new component, remove the heat from the solder.
4. Heat the remaining pad with the soldering iron and apply solder until it wicks to the component. If 
necessary, touch up the first side. All solder joints should be smooth and shiny. NOTE
Do not attempt to puddle out components. Prolonged application of heat may dam-
age the flexible circuit. 
						

							3-4Maintenance
To replace a chip component using hot air:
1. Use the hot-air hand piece and reflow the solder on the solder pads to smooth it. For components 
having two or three solder connections, apply a dot of NO-CLEAN solder paste to the lead joints 
before removal.
2. Apply a drop of solder paste flux to each pad. For dual leaded devices such as SOICs, TSOPs, 
and quad leaded devices less than 20 leads, such as PLCCs and QFPs, apply a bead of solder 
paste.
3. Using a pair of tweezers, position the new component in place. As component is removed, it will 
carry away excess solder, leaving the ideal amount on the pads for their surface area.
4. Position the hot-air hand piece approximately 1/8” (0.3 cm) above the component and begin 
applying heat. For an extensive discussion of chip component rework and other technical proce-
dures, order manual 6880309G53 from Motorola AAD.
5. Once the solder wicks to the component, remove the heat and inspect the repair. All joints should 
be smooth and shiny.
Shields
Removing and replacing shields will be done with the R-1070 R1319A station with the temperature 
control set to approximately 415°F (215°C) [445°F (230°C) maximum].
To remove the shield:
1. Place the circuit board in the R-1070’s holder.
2. Select the proper heat focus head and attach it to the heater chimney.
3. Add paste flux (Motorola P/N 6680333E71) around the base of the shield.
4. Position the shield under the heat-focus head.
5. Lower the vacuum tip and attach it to the shield by turning on the vacuum pump.
6. Lower the focus head until it is approximately 1/8” (0.3 cm) above the shield.
7. Turn on the heater and wait until the shield lifts off the circuit board.
8. Once the shield is off, turn off the heat, grab the par t with a pair of tweezers, and turn off the vac-
uum pump.
9. Remove the circuit board from the R-1070’s circuit board holder.
To replace the shield:
1. Add solder to the shield if necessary, using a micro-tipped soldering iron.
2. Rub the soldering iron tip along the edge of the shield to smooth out any excess solder. Use sol- 
der wick and a soldering iron to remove excess solder from the solder pads on the circuit board.
3. Place the circuit board back in the R1070’s R1319A circuit board holder.
4. Place the shield on the circuit board using a pair of tweezers.
5. Place a small bead of no-clean flux (Motorola P/N 6680333E71) around the tinned surface.
6. Position the heat-focus head over the shield and lower it to approximately 1/8” (0.3 cm) above the 
shield.
7. Turn on the heater and wait for the solder to reflow. The R1319A will record removal time, add 30 
to 40 seconds for replacement.
8. Once complete, turn off the heat, raise the heat-focus head and wait approximately one minute for 
the part to cool.
9. Remove the circuit board and inspect the repair. No cleaning should be necessary. 
						

							Maintenance3-5
3.5 Recommended Test Tools
Table 3-1 lists the recommended tools used for maintaining this family of radios. These tools are also 
available from Motorola.
Table 3-1.  Recommended Test Tools
Motorola Part
Number DescriptionApplication
RSX4043 Torx Driver  Tighten and remove chassis screws
6680387A70T- 6  To r x  B i tRemovable Torx driver bit
WADN4055A
6604008K01
6604008K02Portable soldering station
0.4mm replacement tip
0.8mm replacement tipDigitally controlled soldering Iron
For WADN4055A soldering Iron
0180386A78Illuminated magnifying glass with 
lens attachment.
0180302E51 Illuminated Magnification System Illuminated and magnification of components
0180386A82
6684253C72
6680384A98
1010041A86
0180303E45Anti-static grounding kit
Straight prober
Brush
Solder (RMA type), 63/37, 0.5mm 
diameter
1 lb. spool
SMD tool kit (Include with R1319A)Used during all radio assembly and disassembly
procedures
R-1321A R1319A Shields and
surface-mounted
component and IC
removal/rework station
(order all heat-focus heads
separately)Removal and assembly of surface-mounted
integrated circuits and shields. Includes five noz-
zles
6680334B49
6680334B50
6680334B51
6680334B52
6680334B53
6680370B51
6680370B54
6680370B57
6680370B58
6680371B15
6680371B74
6680332E45
6680332E460.410” x 0.410”
0.430” x 0.430”
0.492” x 0.492”
0.572” x 0.572”
0.670” x 0.790”
0.475” x 0.475”
0.710” x 0.710”
0.245” x 0.245”
0.340” x 0.340”
0.460” x 0.560”
0.470” x 0.570”
0.591” x 0.315”
0.862” x 0.350”Heat-focus heads for R-1319A work station
R1364A Digital Heated Tweezer System Chip component removal
R1427ABoard PreheaterReduces heatsink on multi-level boards
6680309B53 Rework Procedures Manual Contains Application notes, procedures, and tech-
nical references regarding rework equipment 
						

							3-6Maintenance
3.6 Transmitter Troubleshooting Chart
No
Is Q4441 OK ?
Ye s
Is drive from VCO
        >+4dBm? NoIs voltage drop across
     R4497 >4.5V ?No
Check Q4431 gate(open)
and drain resistances
            (11kohm)NoCheck Q4421 gate(open)
and drain resistances
             (11kohm)No
        Check
PCIC_MOSBIAS_1
NoNo
Change
Q4573 
              START
        No power
  
  Is Vctrl
there? Is Q4573
   OK?
Check voltage
on pin 4 U4501
Check voltage
on pin 5 U4501
Check R4422-5
and go back to top
Troubleshoot
ASFIC
Check voltage
on TP4531
Change
PCIC
Check R4409 &
 R4473 and go back
to top
     Check
MOSBIAS_2Check
ASFIC
Are D4471 &
D4472 OK?Change
D4471 &
D4472
NoNo No
NoNo
Ye s
Ye s
Ye s Ye s Ye sYe s
Ye s Ye s
No
NoCheck
PCIC
Ye s
Change Q4421
Change Q4431
Ye s
Change U4401
Ye sDo visual check
on all components
No
Change Q4441
Troubleshoot
        VCO