Motorola Cm Radio Maintainability Manual

							Warranty and Service Support1-3
2.6 Technical Support
Motorola Product Services is available to assist the dealer/distributors in resolving any malfunctions 
which may be encountered.
UK/Ireland - Richard Russell
Telephone:  +44 (0) 1256 488 082
Fax:  +44 01256 488 080
Email:  [email protected]
Central/East Europe- Siggy Punzenberger
Telephone:  +49 (0) 6128 70 2342
Fax:  +49 (0) 6128 95 1096
Email:  [email protected]
Scandinavia
Telephone:  +46 8 735 9282
Fax:  +46 8 735 9280
Email: [email protected]
Germany -Customer Connect Team
Telephone:  +49 (0) 6128 70 2248
Fax:  +49 (0) 6128 95 1082
Email:  [email protected]
France - Lionel Lhermitte
Telephone:  +33 1 6929 5722
Fax:  +33 1 6929 5904
Email:  [email protected]
Italy - Ugo Gentile
Telephone:  +39 0 2822 0325
Fax:  +39 0 2822 0334
Email:  [email protected]
Africa & Middle East -Armand Roy
Telephone: +33 1 6929 5715
Fax: +33 1 6929 5778
Email: [email protected]
2.7 Related Documents
The following documents are directly related to the use and maintainability of this product.
Title Language Part Number
CM Series Product ManualEnglishGMLN1062_
German GMLN1063_
FrenchGMLN1064_
Italian GMLN1065_
Span ishGMLN1066_
Russian GMLN1067_ 
						

							1-4INTRODUCTION
3.0 Radio Model Information
The model number and serial number are located on a label attached to the back of your radio. You 
can determine the RF output power, frequency band, protocols, and physical packages. The 
example below shows one mobile radio model number and its specific characteristics.
Ta b l e 1 - 1Radio Model Number (Example: MDM50FNC9AN2_N)
Type of
UnitModel
SeriesFreq.
BandPower
LevelPhysical
PackagesChannel
SpacingProtocolFeature
LevelModel
RevisionModel
Package
MD M 50 F
Midband
(66-
88MHz)
J
VHF1
(136-
162MHz)
K
VHF2
(146-
174MHz)N
1-25WC
CM140
CM3409
Program-
mableAA
Conven-
tional
MDC1
RF 
Connector : 
Mini-UHF AN
Q
UHF1
(403-
430MHz)P
25-40WF
CM160
CM360AN
5 Tone2
RF 
Connector : 
BNC 
R
UHF2
(438-
470MHz)Q
25-45W
S
UHF3
(465-
495MHz)
 MD = Motorola Internal Use
M = Mobile 
						

							Chapter 2
MAINTENANCE
1.0 Introduction
This chapter of the manual describes:

preventive maintenance

safe handling of CMOS devices

repair procedures and techniques
2.0 Preventive Maintenance
The radios do not require a scheduled preventive maintenance program; however, periodic visual 
inspection and cleaning is recommended.
2.1 Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches 
are functional. It is not recommended to inspect the interior electronic circuitry.
2.2 Cleaning
The following procedures describe the recommended cleaning agents and the methods to be 
used when cleaning the external and internal surfaces of the radio. External surfaces include the 
front cover, housing assembly, and battery case. These surfaces should be cleaned whenever a 
periodic visual inspection reveals the presence of smudges, grease, and/or grime.
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild 
dishwashing detergent in water. The only factory recommended liquid for cleaning the printed 
circuit boards and their components is isopropyl alcohol (70% by volume).
1.Cleaning External Plastic Surfaces
The detergent-water solution should be applied sparingly with a stiff, non-metallic, short-
bristled brush to work all loose dirt away from the radio. A soft, absorbent, lintless cloth or 
tissue should be used to remove the solution and dry the radio. Make sure that no water 
remains entrapped near the connectors, cracks, or crevices.
2.Cleaning Internal Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to dislodge 
embedded or caked materials located in hard-to-reach areas. The brush stroke should 
direct the dislodged material out and away from the inside of the radio. Make sure that 
controls or tunable components are not soaked with alcohol. Do not use high-pressure 
air to hasten the drying process since this could cause the liquid to collect in unwanted 
places. Upon completion of the cleaning process, use a soft, absorbent, lintless cloth to 
dry the area. Do not brush or apply any isopropyl alcohol to the frame, front cover, or 
back cover. NOTE
Internal surfaces should be cleaned only when the radio is disassembled for servicing or
repair.
CAUTION: The effects of certain chemicals and their vapors can have harmful results on
certain plastics. Aerosol sprays, tuner cleaners, and other chemicals should be avoided.
! 
						

							2-2MAINTENANCE
3.0 Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios. 
CMOS characteristics make them susceptible to damage by electrostatic or high voltage 
charges. Damage can be latent, resulting in failures occurring weeks or months later. Therefore, 
special precautions must be taken to prevent device damage during disassembly, 
troubleshooting, and repair. 
Handling precautions are mandatory for CMOS circuits and are especially important in low 
humidity conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS 
CAUTION paragraph in the Disassembly and Reassembly section of the manual. 
4.0 General Repair Procedures and Techniques
IC Pre-Baking
No pre-baking of components is required in the repair of this product.
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement 
component is not locally available, check the parts list for the proper Motorola part number and 
order the component from the nearest Motorola Communications parts center listed in the “Piece 
Parts” section of this manual.
Rigid Circuit Boards
The family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are 
not accessible, some special considerations are required when soldering and unsoldering 
components. The through-plated holes may interconnect multiple layers of the printed circuit. 
Therefore, care should be exercised to avoid pulling the plated circuit out of the hole.
When soldering near the 18-pin and 40-pin connectors: 

avoid accidentally getting solder in the connector. 

be careful not to form solder bridges between the connector pins 

closely examine your work for shorts due to solder bridges. NOTE
Always use a fresh supply of alcohol and a clean container to prevent contamination by
dissolved material (from previous usage). 
						

							General Repair Procedures and Techniques2-3
Chip Components
Use either the RLN4062 Hot-Air Repair Station or the Motorola 0180381B45 Repair Station for 
chip component replacement. When using the 0180381B45 Repair Station, select the TJ-65 mini-
thermojet hand piece. On either unit, adjust the temperature control to 370 °C (700 °F), and 
adjust the airflow to a minimum setting. Airflow can vary due to component density.

To remove a chip component: 
1.Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm 
(1/8) above the component to be removed. 
2.Begin applying the hot air. Once the solder reflows, remove the component using a pair 
of tweezers. 
3.Using a solder wick and a soldering iron or a power desoldering station, remove the 
excess solder from the pads.

To replace a chip component using a soldering iron: 
1.Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the 
solder pads. 
2.Using a pair of tweezers, position the new chip component in place while heating the 
fresh solder. 
3.Once solder wicks onto the new component, remove the heat from the solder. 
4.Heat the remaining pad with the soldering iron and apply solder until it wicks to the 
component. If necessary, touch up the first side. All solder joints should be smooth and 
shiny.

To replace a chip component using hot air:
1.Use the hot-air hand piece and reflow the solder on the solder pads to smooth it. 
2.Apply a drop of solder paste flux to each pad. 
3.Using a pair of tweezers, position the new component in place. 
4.Position the hot-air hand piece approximately 0.3 cm (1/8” ) above the component and 
begin applying heat. 
5.Once the solder wicks to the component, remove the heat and inspect the repair. All 
joints should be smooth and shiny. 
						

							2-4MAINTENANCE
Shields
Removing and replacing shields will be done with the R1070 station with the temperature control 
set to approximately 215°C (415°F) [230°C (445°F) maximum].

To r e m o v e t h e s h i e l d: 
1.Place the circuit board in the R1070 circuit board holder. 
2.Select the proper heat focus head and attach it to the heater chimney. 
3.Add solder paste flux around the base of the shield. 
4.Position the shield under the heat-focus head. 
5.Lower the vacuum tip and attach it to the shield by turning on the vacuum pump. 
6.Lower the focus head until it is approximately 0.3 cm (1/8”) above the shield. 
7.Turn on the heater and wait until the shield lifts off the circuit board. 
8.Once the shield is off, turn off the heat, grab the part with a pair of tweezers, and turn off 
the vacuum pump. 
9.Remove the circuit board from the R1070 circuit board holder.

To replace the shield: 
1.Add solder to the shield if necessary, using a micro-tipped soldering iron. 
2.Next, rub the soldering iron tip along the edge of the shield to smooth out any excess 
solder. Use solder wick and a soldering iron to remove excess solder from the solder 
pads on the circuit board. 
3.Place the circuit board back in the R1070 circuit board holder. 
4.Place the shield on the circuit board using a pair of tweezers. 
5.Position the heat-focus head over the shield and lower it to approximately 0.3 cm (1/8”) 
above the shield. 
6.Turn on the heater and wait for the solder to reflow.
7.Once complete, turn off the heat, raise the heat-focus head and wait approximately one 
minute for the part to cool. 
8.Remove the circuit board and inspect the repair. No cleaning should be necessary. 
						

							Notes For All Schematics and Circuit Boards2-5
5.0 Notes For All Schematics and Circuit Boards
* Component is frequency sensitive. Refer to the Electrical Parts List for value and usage.
1.Unless otherwise stated, resistances are in Ohms (k = 1000), and capacitances are in picofarads 
(pF) or microfarads (µF).
2.DC voltages are measured from point indicated to chassis ground using a Motorola DC 
multimeter or equivalent. Transmitter measurements should be made with a 1.2 µH choke in 
series with the voltage probe to prevent circuit loading.
3.Interconnect Tie Point Legend: 
Signal Name Signal Description
16_8MHz 16.8MHz Reference Frequency from Synthesizer to ASFIC
3V 3V RF regulator
5V 5V RF regulator
5V_CH Optional 5V for Control Head
9V  Regulated 9.3V Supply Voltage
9R 9V to enable RX_INJ when RX_EN is active
ASFIC_CS ASFIC Chip Select
B+ 13.8V Supply Voltage
BATT_SENSE Battery Voltage Sense Line
BOOT_EN_IN_CH Boot Mode Select
BW_SEL Select BW (12.5 KHz, 25 KHz)
CH_ACT Channel Activity Indicator Signal (Fast Squelch)
COMM_DATA_SEL_CH Display Driver Command/ Data Select
D3_V3 Regulated 3.3V supply voltage for Voice Storage
DEMOD Audio Output Signal from the Receiver IC
DETECTOR_AUDIO_SEND_BRD Flat Audio to Option Board
DISPLAY_CS_CH Control Head Chip Select
EMERGENCY_ACCES_CONN Emergency line to switch on the radio voltage regulators
EMERGENCY_SENSE Emergency sense to µP
EXTERNAL_MIC_AUDIO ACCES_CONN External (from accessory connector) microphone input
F1200 Interrupt line from ASFIC CMP
FILT_SW_B+ Switched 13.8 V supply voltage
FLAT_TX_AUDIO_INPUT_ACCESS_CONN Flat TX input from accessory connector
HANDSE RX_AUDIO_CH Handset Audio Output
HOOK_CH Hang-up switch input
HSIO High Speed Clock In / Data Out
IGNITION Ignition Line to switch on he radio’s voltage regulator
KEYPAD_COL_CH Keypad Matrix Column
LOC_DIST Enable Attenuator for RX line
LSIO Low Speed Clock In / Data Out
MIC_AUDIO_CH Microphone Input 
						

							2-6MAINTENANCE
MIC_PTT_CH Microphone PTT Input
MOD_IN Modulation Signal from ASFIC
MOD_OUT Modulation Signal to the Synthesizer
ONOFF_SENSE On off sense switch
OPT_DATA_R_OPRD DATA/Ready Request from Option Board
OPT_EN_OPBD Option Board Chip Select
PA_BIAS PA Control bias voltage
PA_CURRENT Not used
POST_LIMITER_TX 
AUDIO_RETURN_OPT_BRDFlat TX Input from Option Board
PROG x IN ACC y General Purpose Input x accessory connector Pin y
PROG x INOUT ACC y General Purpose Input/Output x accessory connector Pin y
PROG x OUT ACC y General Purpose Input x accessory connector Pin y
PWR_SET PA Power Control Voltage
RESET Reset Line
RSSI Received Signal Strength Indicator
RX RX signal
RX AUD RTN Option Board Input/Output of Receiver Audio Path
RX_AUDIO_OUTPUT_ACCESS_CONN Flat or filtered audio to accessory connector
RX_EN Enable Receiving
RX_INJ RF signal from VCO into the Receiver
SCI_CH Bi-directional serial communication line
SHIFT_R_CS SPI Chip select for the Control Head
SPI_CLK Serial peripheral interface bus CLOCK
SPI_MISO Serial peripheral interface bus data IN
SPI_MOSI Serial peripheral interface bus data OUT
SPKR- Negative Audio PA Speaker Output
SPKR- Negative Audio PA Speaker Output
SPKR+ Positive Audio PA Speaker Output
SQ_DET Squelch Detect Signal
SYNTH_CS Synth Chip Select
SYNTH_LOCK µP Clock Lock Signal
TX AUDIO_RETURN_OPT_BRD Option Board Output to Transmit Audio Path
TX AUDIO_SEND_OPT_BRD Microphone Audio to Option Board
TX_INJ RF signal from the VCO to transmitter PA
TX_EN Enable transmitting
UNMUTED RX_AUDIO_SEND_OPT_BRD Unmuted filtered audio to option board
uP_CLK µP Clock signal
VoL_INDIRECT Volume Pot Input
VOX Voice operated transmit level 
						

							Notes For All Schematics and Circuit Boards2-7
VS AUDIO_SEL Switch signal to Enable option board audio output signal
VS GAIN_SEL Voice Storage Gain Select line
VS_MIC Voice Storage Audio Signal to microphone path
VS_INT Voice Storage Interrupt line
VS_RAC Voice storage Row Address Clock Signal
VSTBY 3.3 V supply for µP when the radio is switched off 
						

							2-8MAINTENANCE